Quality, reliability, and packaging FAQs
TI’s quality policies and procedures help quickly address and resolve any quality-related issue that could arise, from new product qualifications and process change notices to timely resolution of customer issues and complaints. For answers to questions about TI’s quality management system, general quality guidelines (GQG), quality policy manual, change control, and product withdrawal/discontinuance policies, click here.
Our objective is to conduct our business in such a way that protects and preserves the environment, health and safety of our employees, customers, and the communities where we live and operate. For common questions about TI’s material content, environmental compliance, lead-free and conflict material information, click here.
The qualification process confirms that the reliability of our products, processes, and packages meets industry standards. All TI products undergo qualification and reliability testing or qualification by similarity justification prior to release. Common questions about TI’s qualification process can be found here.
PPAP, or Production Part Approval Process is an industry-standard process defined by the Automotive Industry Action Group (AIAG) for submitting product information to customers in the automotive industry and obtaining customer approval to ship products. TI will provide PPAP documentation to any customer purchasing products “Qualified for Automotive Applications” in the TI product datasheet. Common questions about TI’s Automotive PPAP process can be found here.
Quality and reliability of automotive and Hi Rel products is a huge concern for our customers. Find answers here to quality-related questions about TI’s automotive and high-reliablity products for the industrial, space, avionics and defense markets.
Soft errors affect the data state of memories and sequential elements and are caused by random radiation events that occur naturally in the terrestrial environment. For answers to basic questions about soft error rates, including possible causes, factors that affect the SER and how to estimate SER, click here.
TI’s QFN/Son packages offer many advantages, including a small footprint, thin package and excellent thermal performance. Click here for answers to questions about TI’s QFN/SON packaging technology’s benefits and best practices for working with QFN/SON devices.
TI’s WCSP packaging technology is well-suited for a range of applications due to its small footprint and other benefits. Find answers here to your questions about TI’s WCSP packaging technology advantages and best practices for working with WCSP devices.
Find answers to common questions about copper wire, surface mount technology and thermal issues here.
For answers to general questions about standard terms and conditions of sale, return and refunds information, package drawing and marking, click here
To better understand the customer’s observed issue, TI requests detailed and accurate information about the device and the test conditions at the time of the issue. This allows for a more efficient flow through TI’s return process. For instructions on locating the requested device information, click here.