Memory and Semiconductor Test Equipment

Memory and Semiconductor Test Equipment integrated circuits and reference designs

Description

Our integrated circuits and reference designs help you create high accuracy testers at wafer, package and board levels enabling dense solutions for a high number of channels while minimizing channel-to-channel variation.

    Next generation semiconductor testers often require:

  • Highest levels of speed and accuracy through data acquisition channels
  • Tight temperature controls to minimize measurement drift
  • Precise reference voltage generation to improve measurement accuracy
  • Low jitter clock distribution to maximize SNR performance
  • Highly integrated, low-height power modules minimizing board-to-board spacing

Technical documents

Application notes & user guides

Application Notes (10)

Title Abstract Type Size (KB) Date Views
PDF 108 KB 31 Aug 2018 356
PDF 213 KB 18 Sep 2017 261
PDF 795 KB 20 Jul 2017 272
HTM 8 KB 14 Jun 2017 50
PDF 177 KB 03 Jan 2017 86
HTM 8 KB 17 May 2016 86
HTM 8 KB 16 Apr 2015 201
HTM 9 KB 10 Sep 2010 138
PDF 285 KB 28 Feb 2005 142
HTM 8 KB 14 Jun 2004 123

Product bulletin & white papers

White Papers (6)

Title Abstract Type Size (MB) Date Views
PDF 688 KB 01 Feb 2018 94
PDF 149 KB 08 Nov 2016 84
PDF 1.25 MB 15 Sep 2016 291
PDF 3.07 MB 01 Aug 2016 289
PDF 2.13 MB 31 Mar 2016 77
PDF 1011 KB 26 Jan 2016 107

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