Memory & semiconductor test equipment

Memory and Semiconductor Test Equipment integrated circuits and reference designs

Description

Our integrated circuits and reference designs help you create high accuracy testers at wafer, package and board levels enabling dense solutions for a high number of channels while minimizing channel-to-channel variation.

    Next generation semiconductor testers often require:

  • Highest levels of speed and accuracy through data acquisition channels
  • Tight temperature controls to minimize measurement drift
  • Precise reference voltage generation to improve measurement accuracy
  • Low jitter clock distribution to maximize SNR performance
  • Highly integrated, low-height power modules minimizing board-to-board spacing
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Technical documents

Application notes & user guides

Application Notes (11)

Title Abstract Type Size (KB) Date
PDF 217 KB 11 Feb 2019
PDF 107 KB 31 Aug 2018
PDF 213 KB 18 Sep 2017
PDF 795 KB 20 Jul 2017
HTM 8 KB 14 Jun 2017
PDF 177 KB 03 Jan 2017
PDF 261 KB 17 May 2016
PDF 132 KB 16 Apr 2015
HTM 9 KB 10 Sep 2010
PDF 285 KB 28 Feb 2005
HTM 8 KB 14 Jun 2004

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