Handset: SmartphoneTI’s wireless solutions, including OMAP™ applications processors, connectivity and analog technologies, help manufacturers deliver unparalleled mobile user experiences in Smartphones. |
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Handset: SmartphoneTI’s wireless solutions, including OMAP™ applications processors, connectivity and analog technologies, help manufacturers deliver unparalleled mobile user experiences in Smartphones. |
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Design ConsiderationsInfrared TemperatureGiven that today's Smartphone integrates features like personal organizers and email management tools with basic multimedia and handset capabilities, the typical "ON" time is more crucial to the end users than that of an entry level mobile phone. The feature set drives the need for high processing power, larger (brighter) displays, touch screen controls and speaker phone capability. To meet performance and form factor requirements of the phone, careful consideration to the supply current and package sizes is important. Hence, migrating to Class-D audio amplifiers, touch screen controllers with integrated audio, ESD protection, power management and overall power supply efficiency are critical. To meet the growing demand for advanced multimedia features in the growing mid-range wireless market, TI offers the OMAP™ solutions platform. TI provides silicon and software products supporting Real-Time and High Level Operating Systems, and a wide range of Open Source communities. TI's wireless systems expertise spans handsets across multiple communications standards as well as wireless connectivity solutions including WiLink™ mobile LAN solutions, NaviLink™ GPS and BluLink™ Bluetooth™ solutions. TI solutions enhance the user experience with innovative 3D-graphics, high-quality video applications and advanced user interfaces. TI's Video, audio and power management offering includes a series of system solutions for the development of these complex phones. Power Management: TI offers power management solutions targeting the wide range of applications/graphic processors, feature-set and lighting voltage requirements often found in these phones. Special step-down DC/DC converters like the TPS624xx/ TPS65xxx families enable advanced dynamic voltage scaling to meet the needs of the newest mobile processors. TI TPS630xx family offers best-in-class 96% efficiency over a wide battery voltage range with input voltage down to 1.8 volts to extend battery life and provide support for emerging Li-ion battery technology. LDOs TPS799xx/ TPS717xx are available for additional power rails. The TPS65K family of power management units (PMUs) offers highest integration for handsets. The latest PMU generation includes stereo audio codecs and HS USB 2.0 on-the-go (OTG). These devices also integrate several high-efficiency DC/DC buck converters and low-dropout regulators (LDOs) for the processor core, IO, memory and other voltages. Additional functions such as a battery charger, LED boost converters, ADCs and a touch-screen controller are also integrated depending on the PMU family. TI’s SmartReflex™ technology and dynamic voltage frequency scaling (DVFS) can significantly extend battery lifetime by adjusting the output voltages to the required performance with an I2C interface or logic high/low. Requirements for wall-plug and USB-port charging can be addressed with the bq240xx family. Innovative next-generation gas gauge solutions are offered in the bq275xx using "Impedance Track" to automatically learn/detect battery character and provide status data to the host via a simple interface, eliminating the need for learning cycles and look-up tables. TI has solutions for both ID ROM and CRC authentication (bq20xx and bq161xx). Support for different lengths of encryption key depth is provided. Audio Considerations: Smartphones seek to enhance the user's audio experience with signal-to-noise ratios (SNRs) exceeding 100 dB and improved features such as multi-band equalizers, 3-D surround effects and echo/noise cancellation. Low power consumption is always a key consideration in all such designs. Full feature audio codecs in the TLV320AICxxxx/TLV320DACxxxx/PCMxxxx families integrate mono- and stereo-AD/DA converters and headphone/speaker amplifiers. Class-D amplifiers continue to increase in popularity because of their high efficiency and small-footprint packages. In some devices, an integrated DSP supports dynamic range compression, multi-band equalization, noise/echo cancellation and custom filtering. Newer generation TI audio codecs, such as the TLV320AIC3254, process sound with better audio quality and longer battery life. Display/Lighting and Touch Screen Considerations: Latest-generation drivers such as TPS6115x/6x offer flexibility in the number of LEDs to be driven (3 to 10) and enable pulse-width modulation and digital dimming with up to 32 steps for brightness control in a small, 2x2 mm2 package. TI provides OLED-specific drivers like the TPS6108x/6114x. For illuminating keypads and fashion lighting, new LDO-based forward-voltage LED drivers are available (TPS751xx) as are 2- and 4-multilamp EL drivers for different color segmentation. Camera flash capability is addressed by the TPS61050 family with small footprint in CSP or QFN packages. TI offers integrated touch-screen controller solutions like the TSC21xx/TSC23xx families with integrated ESD protection that is an added value. Touch-screen operation can easily result in discharges up to 12KV; a stand-alone TSC provides the best isolation from the rest of the phone electronics. The TSC2k family of touch screen controllers achieves low power consumption and is immune to vibration and display noise; small-footprint packages are available. Display I/O voltage is typically > 2.7V which can create a mismatch with other digital logic; 20 and 24-bit level shifters such as SN74AVC20Txxx can be used to resolve I/O compatibility problems. Application Notes (10)
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| Description | Part # | Company |
| Multiphase for Handset Power Supply (5V @ 40A) | PMP1666 | Texas Instruments |
| Sync Buck for Global Systems for Mobile (GSM) (1.4V @ 3.2A, 6.5V @ 7.5A, 3.3V @ 6A) | PMP1908 | Texas Instruments |
| Title | Abstract | Type | Size (KB) | Date | Views |
|---|---|---|---|---|---|
| 8.92 MB | 23 Mar 2011 | 32782 | |||
| 4.16 MB | 23 Jul 2009 | 12776 |
| Title | Abstract | Type | Size (KB) | Date | Views |
| 1.57 MB | 28 Mar 2008 | 1361 |
| Name | Part # | Company | Software/Tool Type |
| Code Composer Studio (CCStudio) Integrated Development Environment (IDE) v5 | CCSTUDIO | Texas Instruments | Code Composer Studio(TM) IDE |
| Title | Abstract | Type | Size (MB) | Date | Views |
|---|---|---|---|---|---|
| 1.17 MB | 08 Apr 2011 | 20036 | |||
| 369 KB | 12 Nov 2010 | 3117 | |||
| 529 KB | 16 Sep 2009 | 831 | |||
| 669 KB | 14 Feb 2009 | 2669 |
| Title | Abstract | Type | Size (MB) | Date | Views |
|---|---|---|---|---|---|
| 1.22 MB | 02 Oct 2009 | 1022 | |||
| 213 KB | 26 Mar 2009 | 3337 | |||
| 97 KB | 14 Feb 2009 | 2798 | |||
| 264 KB | 14 Feb 2009 | 5028 | |||
| 480 KB | 14 Feb 2009 | 2414 | |||
| 72 KB | 18 Aug 2008 | 22 |
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