Dual-mode Bluetooth® CC2564 evaluation board


Description & Features

Technical Documents

Support & Community

Order Now


The CC256XQFNEM evaluation board contains the CC2564B device and is intended for evaluation and design purposes for the CC256x devices.

For a complete evaluation solution, the CC256XQFNEM board plugs directly into the TI hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C123G, and DK-TM4C129X. Moreover, a certified and royalty-free TI Bluetooth Stack is available for the MSP430 (CC256XMSPBTBLESW) and TM4C12x MCUs (CC256XM4BTBLESW).

The CC256XQFNEM hardware design files (schematics, layout and BOM) are provided as a reference to aid in the implementation of the CC256x devices.

  • CC2564B device (QFN package)
  • Bluetooth Specification v4.1
  • Dual Mode - Bluetooth & Bluetooth low energy
  • FCC, IC, CE certified
  • Class 1.5 Transmit Power (+12dBm)
  • High sensitivity (-93 dBm typ.)
  • UART Interface - Control and Data
  • PCM/I2S Interface - Voice and Audio
  • 4 Layer PCB design
  • 1.8 LDO (LP2985-18)
  • 3 Voltage level translators (SN74AVC4T774)
  • PCB antenna
  • EM connectors that plug directly into the TI hardware development kits:
    • MSP-EXP430F5529
    • MSP-EXP430F5438
    • DK-TM4C123G
    • DK-TM4C129X
  • COM connector
  • Certified and royalty-free TI Bluetooth Stack

What's Included

  • 1 CC256x EM board with TI CC256x device with QFN package
  • 1 Jumper for MSP-EXP430F5438 board
  • 4 Jumpers for MSP-EXP430F5529 board
  • Experimenter boards sold separately

Order Now
Part Number Buy from Texas Instruments or Third Party Buy from authorized distributors Status

Dual-mode Bluetooth® CC2564 evaluation board


Pricing may vary.

Contact a Distributor  

TI's Standard Terms and Conditions for Evaluation Modules apply.

Technical Documents
Third party documents (1)
*This is not an TI official document.
Title Date Type
Surface Mount Assembly of Amkor’s Dual Row MicroLeadFrame (MLF) Packages 09 Jul 2015
Application notes (4)
Title Abstract Type Size (KB) Date Views
PDF 1805 09 Mar 2015 1,441
PDF 138 12 Feb 2013 9,661
Multiple Files   28 Nov 2011 1,130
PDF 1836 06 Oct 2010 6,966
User guides (7)
*This is not an TI official document.
Title Abstract Type Size (KB) Date Views
Wiki* 16 Jun 2015
Wiki* 01 Jul 2015
Wiki* 09 Jul 2015
PDF 4623 08 Jul 2015 674
PDF 1717 21 May 2015 646
Multiple Files   19 May 2015 716
ZIP 18 03 Jun 2013 768
Solution guides (1)
Title Abstract Type Size (KB) Date Views
PDF 3204 03 Aug 2015 13,416
White papers (2)
Title Abstract Type Size (KB) Date Views
PDF 393 27 Jun 2014 9,545
PDF 322 25 Mar 2014 3,574
More literature (1)
Title Abstract Type Size (KB) Date Views
PDF 551 05 Mar 2015 1,333

Software (4)

Name Part Number Software Type
TI Dual-Mode Bluetooth® Stack  TIBLUETOOTHSTACK-SDK  Software Development Kits (SDK) 
TI Dual-mode Bluetooth® stack on MSP430™ MCUs  CC256XMSPBTBLESW  Software Development Kits (SDK) 
TI dual-mode Bluetooth® stack on TM4C MCUs  CC256XM4BTBLESW  Software Development Kits (SDK) 

Design Kits & Evaluation Modules (2)

Name Part Number Tool Type
Dual-mode Bluetooth® CC2564 module evaluation board  CC2564MODNEM  Evaluation Modules & Boards 
EZ430-RF256x Bluetooth Evaluation Tool  EZ430-RF256X  Evaluation Modules & Boards 

Reference Designs (1)

Name Part Number Tool Type
CC256x Bluetooth® Reference Design  CC256XEM-RD  TI Designs

TI Devices (5)

Part Number Name Product Family
CC2560  Bluetooth® CC2560 Controller  Wireless Connectivity 
CC2564  Dual-Mode Bluetooth® CC2564 Controller  Wireless Connectivity 
CC2564MODN  Dual-Mode Bluetooth® CC2564 Module  Wireless Connectivity 
LP2985-18  Single Output LDO, 150mA, Fixed(1.8V), 1.5% Tolerance, Low Quiescent Current, Low Noise  Linear Regulator (LDO) 
SN74AVC4T774  4-Bit Dual-Supply Bus Transceiver With Configurable Voltage-Level Shifting and 3-State Outputs  Voltage Level Translation 


Visit the TI Wiki

TI E2E™ community

TI E2E Community

As a member of my.TI you can join the TI E2E™ Community where you can ask questions, share ideas and collaborate with fellow engineers and TI experts

Contents are provided "AS IS" by the respective TI and Community contributors and do not constitute TI specifications. See Terms of use.