Lehi, Utah: 300mm wafer fabs
Building the next era of semiconductor manufacturing
Manufacturing in Lehi, Utah
We’re building a new 300-millimeter semiconductor wafer fabrication plant in Lehi, Utah, that will begin production as early as 2026. The new fab (LFAB2) currently under construction, will connect to our existing fab (LFAB1) in the heart of the Silicon Slopes. At full production, TI’s two wafer fabs in Utah will manufacture tens of millions of analog and embedded processing chips every day that will go into electronics everywhere. These fabs are a part of TI’s long-term strategy to build manufacturing capacity to support customer growth for decades to come.
Lehi by the numbers
Our growing presence in Utah is about more than manufacturing chips. We’re impacting the local community with the creation of new jobs and substantial investments in STEM education for students in kindergarten through 12th grade. As part of our commitment to responsible, sustainable manufacturing, LFAB2 will become one of TI’s most environmentally efficient wafer fabs.
Through the years: Lehi, Utah 300mm wafer fabs
Recent news
TI breaks ground on second 300mm wafer fab in Lehi, Utah
November 2, 2023 – Texas Instruments celebrates the first steps toward construction of its new fab, LFAB2.
TI selects Lehi for its next 300mm wafer fab
February 15, 2023 – Texas Instruments selects Lehi, Utah for its next 300mm semiconductor wafer fabrication plant.
LFAB1 begins production
December 6, 2022 – LFAB begins production in 2022, about one year after our company purchased the facility.
Media contact
For media questions, please reach out to mediarelations@ti.com.
Lehi, Utah press kit
Click below to access images, video b-roll and fact sheets.