Building the next era of semiconductor manufacturing in Lehi
In February 2023, TI announced it will build a second 300-mm wafer fab in Lehi, Utah, LFAB2. The $11 billion investment is the largest economic investment in Utah history, and supports TI’s long-term manufacturing roadmap, building capacity to support our customers’ growth for decades to come. Construction is expected to start in 2023 with production as early as 2026.
Lehi, Utah is home to Texas Instruments’ 300-mm semiconductor wafer fabrication plant (or “fab”), LFAB1. LFAB1 went into production in late 2022.
TI selects Lehi for its next 300-mm wafer fab
February 15, 2023 – Texas Instruments selects Lehi, Utah for its next 300-mm semiconductor wafer fabrication plant.
LFAB begins production
December 6, 2022 – LFAB begins production in 2022, about one year after our company purchased the facility.
Texas Instruments purchases fab in Lehi, Utah
June 30, 2021 – Texas Instruments purchases 300-mm semiconductor wafer fabrication plant in Lehi, Utah.
LFAB went into production in late 2022 and supports 65-nm and 45-nm technologies with the ability to go beyond those nodes as required. At full production, the fab will manufacture tens of millions of analog and embedded chips daily.
Through the years: Lehi, Utah 300-mm wafer fabs
Building advanced manufacturing capacity
Our investment in internal manufacturing capacity provides greater assurance of supply, supporting our customers’ growth for decades to come.
Building a sustainable future
We have a long-standing commitment to responsible, sustainable manufacturing.
Building stronger communities
We are committed to building stronger communities where we live and work around the world.
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