Worldwide manufacturing

Worldwide manufacturing

We manufacture tens of billions of analog and embedded processing semiconductors annually, across approximately 80,000 different products, and deliver them to more than 100,000 customers around the globe. Our investment in internal manufacturing capacity provides greater assurance of supply, supporting our customers’ growth for decades to come.

Our global manufacturing footprint

We have a long history of globally owned, regionally diverse internal manufacturing operations, with currently 11 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities across 15 worldwide sites.

manufacturing footprint

Investing in manufacturing

We’re making strategic investments to grow 300-mm wafer fab manufacturing, which provide advantages in efficiency and quality, and targeted investments in existing 200-mm capacity. Our assembly and test sites – which separate individual semiconductor products from the wafer and assemble, package and test them – are undergoing continuous expansion, modernization and automation to meet customer demand.

300-mm wafer fab manufacturing


Sherman, Texas        

Announced in November 2021, the site has the potential for four fabs to meet demand over time. Construction is underway, and production from the first fab is expected in 2025.


Lehi, Utah (LFAB)

LFAB was acquired in October 2021. It will start with 65-nm and 45-nm production for our analog and embedded products, and will be able to go beyond those nodes as required. First production is expected in early 2023. 


Richardson, Texas (RFAB)

RFAB1 ramped in 2010 as the world’s first 300-mm analog wafer fab. RFAB2 is a 300-mm wafer fab expansion on our existing Richardson site. Tool installations are underway and first production is expected in the second half of 2022.

Dallas, Texas (DMOS6)

Dallas, Texas (DMOS6)

DMOS6 ramped for 300-mm analog technologies in 2014, and is one of our first 300-mm wafer fab operations.

 

“Investing in internal manufacturing and technology development for our analog and embedded processing products is central to our success. Our capacity and technology roadmaps will provide customers the capacity and products they need for the future.”

- Kyle Flessner | Senior vice president, Technology and Manufacturing Group

Optimal technology for analog and embedded processing

We’re investing and increasing capacity in 45- to 130-nm technology nodes, which provide the optimal cost, performance, power, precision and voltage levels required in all markets, including the harsh environments typical to industrial and automotive. Our investments in these technologies recognize the criticality and long-term need for these nodes, and allow us to provide customers with products that will be needed for decades to come.

manufacturing footprint
manufacturing footprint

Control and flexibility

Our goal is to deliver products to our customers where and when they’re needed. Our flexible manufacturing strategy and control of our supply chain provide greater assurance of supply to meet current and future demands, with robust business continuity processes to support unpredictable markets. We have the ability to source more than 75% of products from multiple sites to speed up delivery time for our customers.

Sustainable manufacturing

We have a long-standing commitment to responsible, sustainable manufacturing, including:

  • Reducing energy and greenhouse gas emissions through upgraded factory tools, abatement technology and using more alternative energy
  • Reusing or recycling nearly 90% of our waste and surplus materials
  • Reusing much of our water
  • Designing our new facilities to meet LEED standards for structural efficiency and sustainability

Learn more in our Corporate Citizenship Report

manufacturing footprint