Worldwide manufacturing

Building the next era of semiconductor manufacturing

Delivering geopolitically dependable supply

Designing and manufacturing innovative products has been at the core of our business for decades. We operate 15 sites around the globe, including wafer fabs, assembly and test factories, and bump and probe facilities, in addition to strategically located product distribution centers. We are expanding our internal operations – building on decades of proven and reliable manufacturing expertise – to provide the assurance of supply our customers need, to get products where and when they need them. 

What sets us apart

Support for growth

We’re expanding our global manufacturing footprint with strategic investments in 300mm wafer fabs to support the capacity our customers will need for decades to come. Assembly and test factories and product distribution centers are undergoing continuous expansion and automation.

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Control of our supply

Our internal wafer manufacturing and assembly and test operations are growing to support more than 95% of our production by 2030. This expanded footprint will give us control over our own supply to meet current and future demands.

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Owning our process technologies

We’re investing and increasing capacity in 45 to 130nm nodes to meet the critical and long-term need for essential chips. We develop and own our process technologies to optimize products for price and performance.

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Sustainable manufacturing

We have a long-standing commitment to responsible, sustainable manufacturing, including reusing or recycling water and 90% of our waste materials. Our new 300mm factories are designed to meet LEED Gold standards and will be powered by 100% renewable electricity.

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15

worldwide manufacturing sites

10B+

chips manufactured per year

95%

of manufacturing internal by 2030

100%

renewable electricity worldwide by 2030

300mm wafer fabs

300mm wafer fabs are the most efficient high-volume wafer factories in the world. The 300-millimeter (or 12-inch) wafer is the largest and most advanced diameter size for silicon wafers – able to hold millions of individual semiconductor chips. Our 300mm wafer fabs will produce more chips per wafer with advanced equipment and fully automated manufacturing flows for maximum efficiency.

Sherman, Texas (SM1, SM2, SM3, SM4)

Announced in November 2021, the site has the potential for four fabs operating as one site to meet demand over time. Construction is underway, and production from the first fab is expected in 2025.

Read about Sherman

Lehi, Utah (LFAB1, LFAB2)

LFAB was purchased in 2021 and began 300mm wafer production in 2022. Announced in February 2023, a second 300mm semiconductor wafer fab is under construction on the site and will connect to the existing fab.

Read about Lehi

Richardson, Texas (RFAB1, RFAB2)

RFAB opened in 2009 as the world’s first 300mm analog wafer fab. A second 300mm wafer fab connected to the first fab started production in 2022.

Read about Richardson

An inside look

Ever wonder how the tiny chips powering your devices are made? Take a peek inside one of our 300mm wafer fabs and explore the three levels of this high-tech facility, where millions of chips are manufactured daily.

Click through the image to learn more about where semiconductor chips are made.

Fan deck level

The top level of the fab contains the specialized fan systems that purify the air and maintain consistent temperature and humidity. The equipment pumps the clean air down into the fab.

arrow-right Take a virtual tour of the fab

Cleanroom level

The cleanroom is where semiconductor chips are made. Thousands of the world’s most sophisticated and complex machines, called “tools” take bare silicon wafers through hundreds of process steps to create millions of chips every day. Cleanroom employees wear “bunny suits,” designed to protect the wafers from lint, hair, oil or even flakes of skin.

arrow-right Take a virtual tour of the fab

Subfab level

The bottom level of the fab houses the pumps, power cabinets, utility pipes and other equipment that power the tools in the cleanroom. The complicated network of pipes running through the ceiling into the clean room floor through a series of holes called a “waffle table.” This allows us to bring essential elements like water, chemicals and gases into the fab.

arrow-right Take a virtual tour of the fab
Fan deck level
Cleanroom level
Subfab level

A flexible supply chain

We have owned and operated wafer fabs around the world for decades – producing high-quality and reliable chips. With increased investments to automate and modernize our existing fabs, we are able to efficiently manufacture billions of foundational semiconductors now and in the future. Coupled with our new 300mm capacity expansion projects, we can provide better assurance of the supply our customers need.

We own and operate assembly and test facilities (A/Ts) around the world, where the individual semiconductor chip is separated from the wafer and assembled, packaged and tested. The back-end manufacturing process is a key part of our internal manufacturing operations and undergoing continuous expansion, modernization and automation to support customer demand.

Once TI products are packaged and tested, they are shipped to one of our product distribution centers (PDCs), which are strategically located around the globe to provide fast, reliable delivery. We are continuously growing our PDC network with additional locations and automating systems to increase productivity. 

A core element of our strategy is to grow capacity across our global manufacturing footprint and continue to advance our processes to ensure high quality devices. Our goal is to provide customers with geopolitical dependability and diverse sourcing options they need to support their growth for decades to come.
– Mohammad Yunus | Texas Instruments senior vice president, Technology and Manufacturing Group

Expanding capacity with assembly & test sites

TI operates seven state-of-the-art assembly and test sites globally that play a vital role in transforming semiconductor wafers into finished chips. Our focus is on modernization, automation, and capacity expansion of our back-end manufacturing.

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Recent news

TI announces award agreement for U.S. CHIPS Act funding

December 20, 2024 – Up to $1.6 billion in direct funding supports TI’s semiconductor manufacturing expansions in Texas and Utah.

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TI to receive proposed U.S. CHIPS Act funding

August 16, 2024 – Proposed funding, coupled with an estimated $6 billion to $8 billion in investment tax credit, will help TI provide geopolitically dependable, 300mm capacity for analog and embedded processing semiconductors.

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Texas Instruments breaks ground on new 300mm semiconductor wafer fabrication plant in Utah

November 2, 2023 – TI announces plans with the Alpine School District to create the first district-wide K-12 STEM learning community in the state.

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Media contact

For media questions, please reach out to mediarelations@ti.com.

 

Press kits

Click below to access TI manufacturing images, video b-roll and fact sheets.