SBAS969 September   2026 ADS111C02

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 Timing Diagram
  8. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Multiplexer
      2. 8.3.2 Voltage Reference
      3. 8.3.3 Oscillator
      4. 8.3.4 Output Data Rate and Conversion Time
      5. 8.3.5 Low-Noise PGA
      6. 8.3.6 Temperature Sensor
        1. 8.3.6.1 12-Bit Temperature Data Format (ADS101C0x)
        2. 8.3.6.2 Converting from Digital Codes to Temperature, 12-Bit Temperature Sensor Data
        3. 8.3.6.3 14-Bit Temperature Data Format (ADS101C0x)
        4. 8.3.6.4 Converting from Digital Codes to Temperature, 14-Bit Temperature Sensor Data
      7. 8.3.7 Digital Comparator
      8. 8.3.8 Conversion-Ready Pin
      9. 8.3.9 SMBus Alert Response
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Up and Reset
      2. 8.4.2 Operating Modes
        1. 8.4.2.1 Single-Shot Conversion Mode
        2. 8.4.2.2 Continuous-Conversion Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
      2. 8.5.2 I2C Address Selection
      3. 8.5.3 Serial Clock (SCL) and Serial Data (SDA)
      4. 8.5.4 I2C Interface Speed
      5. 8.5.5 I2C Data Transfer Protocol
      6. 8.5.6 Writing To and Reading From the Registers
      7. 8.5.7 Timeout
      8. 8.5.8 I2C General-Call (Software Reset)
    6. 8.6 Conversion Data Format
  10. 9 Register Maps
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Serial Interface Connections
      2. 10.1.2 Connecting Multiple Devices
      3. 10.1.3 Single-Ended Inputs
      4. 10.1.4 Unused Inputs and Outputs
      5. 10.1.5 Input Protection
      6. 10.1.6 Analog Input Filtering
      7. 10.1.7 Duty Cycling For Low Power
      8. 10.1.8 I2C Communication Sequence Example
    2. 10.2 Typical Applications
      1. 10.2.1 K-Type Thermocouple with Thermistor Cold-Junction Compensation
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
      2. 10.2.2 Server Card System Monitoring Application
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Power-Supply Sequencing
      2. 10.3.2 Power-Supply Decoupling
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.4.2 Layout Example

Figure 10-12 shows a basic layout example for the ADS1x1C0x:

  • C3 is the power supply decoupling capacitor. Place C3 as close as possible to the supply pin.
  • Connect the GND pin to the ground plane.
  • Differential antialiasing RC-filters are shown for the differential input pairs AIN0-AIN1 and AIN2-AIN3, respectively.
  • R5, R6, and R7 are the I2C bus pullup resistors.

ADS101C01 ADS101C01L ADS101C02 ADS101C02L ADS111C01 ADS111C01L ADS111C02 ADS111C02L ADS1x1C02 X2QFN Package Figure 10-12 ADS1x1C02 X2QFN Package