SBAS778B June   2017  – August 2019 ADS1287

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input and Multiplexer
      2. 8.3.2 Programmable Gain Amplifier (PGA)
      3. 8.3.3 Modulator
        1. 8.3.3.1 Modulator Overrange
      4. 8.3.4 Voltage Reference Inputs (REFP, REFN)
      5. 8.3.5 Digital Filter
        1. 8.3.5.1 Sinc Filter Stage
        2. 8.3.5.2 FIR Filter Stage
        3. 8.3.5.3 Group Delay and Step Response
          1. 8.3.5.3.1 Linear Phase Response
          2. 8.3.5.3.2 Minimum Phase Response
        4. 8.3.5.4 HPF Stage
      6. 8.3.6 Reset (RESET Pin and Reset Command)
      7. 8.3.7 Master Clock Input (CLK)
    4. 8.4 Device Functional Modes
      1. 8.4.1  Operational Mode
      2. 8.4.2  Chop Mode
      3. 8.4.3  Offset
      4. 8.4.4  Power-Down Mode
      5. 8.4.5  Standby Mode
      6. 8.4.6  Synchronization
        1. 8.4.6.1 Pulse-Sync Mode
        2. 8.4.6.2 Continuous-Sync Mode
      7. 8.4.7  Reading Data
        1. 8.4.7.1 Read-Data-Continuous Mode (RDATAC)
        2. 8.4.7.2 Stop-Read-Data-Continuous-Mode (SDATAC)
      8. 8.4.8  Conversion Data Format
      9. 8.4.9  Offset and Full-Scale Calibration Registers
        1. 8.4.9.1 OFC[2:0] Registers
        2. 8.4.9.2 FSC[2:0] Registers
      10. 8.4.10 Calibration Command
        1. 8.4.10.1 OFSCAL Command
        2. 8.4.10.2 GANCAL Command
      11. 8.4.11 User Calibration
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Data Input (DIN)
        4. 8.5.1.4 Data Output (DOUT)
        5. 8.5.1.5 Serial Interface Timeout
        6. 8.5.1.6 Data Ready (DRDY)
      2. 8.5.2 Commands
        1. 8.5.2.1  WAKEUP: Wake Up Command
        2. 8.5.2.2  STANDBY: Standby Mode Command
        3. 8.5.2.3  SYNC: Synchronize ADC Conversions
        4. 8.5.2.4  RESET: Reset Command
        5. 8.5.2.5  RDATAC: Read Data Continuous Mode Command
        6. 8.5.2.6  SDATAC: Stop Read Data Continuous Mode Command
        7. 8.5.2.7  RDATA: Read Data Command
        8. 8.5.2.8  RREG: Read Register Data Command
        9. 8.5.2.9  WREG: Write Register Data Command
        10. 8.5.2.10 OFSCAL: Offset Calibration Command
        11. 8.5.2.11 GANCAL: Gain Calibration Command
    6. 8.6 Register Map
      1. 8.6.1 Register Descriptions
        1. 8.6.1.1 ID/CFG: ID, Configuration Register (address = 00h) [reset = x0h]
          1. Table 22. ID/CFG Register Field Descriptions
        2. 8.6.1.2 CONFIG0: Configuration Register 0 (address = 01h) [reset = 52h]
          1. Table 23. CONFIG0 Register Field Descriptions
        3. 8.6.1.3 CONFIG1: Configuration Register 1 (address = 02h) [reset = 08h]
          1. Table 24. CONFIG1 Register Field Descriptions
        4. 8.6.1.4 High-Pass Filter Corner Frequency (HPFx) Registers (address = 03h, 04h) [reset = 32h, 03h]
          1. Table 25. HPF0, HPF1 Registers Field Description
        5. 8.6.1.5 Offset Calibration (OFCx) Registers (address = 05h, 06h, 07h) [reset = 00h, 00h, 00h]
          1. Table 26. OFC0, OFC1, OFC2 Registers Field Description
        6. 8.6.1.6 Full-Scale Calibration (FSCx) Registers (address = 08h, 09h, 0Ah) [reset = 00h, 00h, 40h]
          1. Table 27. FSC0, FSC1, FSC2 Registers Field Description
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Geophone Application
      2. 9.2.2 Digital Interface
    3. 9.3 Initialization Set Up
  10. 10Power Supply Recommendations
    1. 10.1 Analog Power Supplies
    2. 10.2 Digital Power Supply
    3. 10.3 Power-Supply Sequence
  11. 11Layout
    1. 11.1 Layout Guidelines
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Timing Requirements

over operating ambient temperature range and DVDD = 2.25 V to 3.6 V (unless otherwise noted)
MIN MAX UNIT
SERIAL INTERFACE
td(CSSC) Delay time, CS falling edge to first SCLK rising edge 40 ns
tc(SC) SCLK period 250 ns
SCLK period specific to SYNC and RESET commands 2 1 / fCLK
tw(SCH), tw(SCL) Pulse duration, SCLK high and low(1) 100 ns
Pulse duration, SCLK high and low specific to SYNC and RESET commands 0.8 1 / fCLK
tsu(DI) Setup time, DIN valid before SCLK rising edge 50 ns
th(DI) Hold time, DIN valid after SCLK rising edge 50 ns
tw(CSH) Pulse duration, CS high 100 ns
td(SCCS) Delay time, last SCLK rising edge to CS rising edge 24 1 / fCLK
td(CMBT) Delay time, after each byte within and between command sequences(3) 24 1 / fCLK
SYNCHRONIZATION
td(CLSY) Delay time, CLK rising edge to SYNC rising edge(2) 30 –30 ns
tw(SYH), tw(SYL) Pulse duration, SYNC high or SYNC low 2 1 / fCLK
RESET
tsu(RSCL) Setup time, RESET rising edge to a specific CLK rising edge 10 ns
tw(RSL) Pulse duration, RESET low 2 1 / fCLK
(1) Holding SCLK low for 64 DRDY periods forces a serial interface reset.
(2) SYNC rising edge to CLK rising edge must not occur within the specified time window.
(3) When reading conversion data, the byte-to-byte delay is not required (td(CMBT)).