SBASAP8A december   2022  – august 2023 ADS131B23

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagram
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Offset Drift Measurement
    2. 7.2 Gain Drift Measurement
    3. 7.3 Noise Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Naming Conventions
      2. 8.3.2 Precision Voltage References (REFA, REFB)
      3. 8.3.3 Clocking (MCLK, OSCM, OSCD)
      4. 8.3.4 ADC1y
        1. 8.3.4.1 ADC1y Input Multiplexer
        2. 8.3.4.2 ADC1y Programmable Gain Amplifier (PGA)
        3. 8.3.4.3 ADC1y ΔΣ Modulator
        4. 8.3.4.4 ADC1y Digital Filter
        5. 8.3.4.5 ADC1y Offset and Gain Calibration
        6. 8.3.4.6 ADC1y Conversion Data
      5. 8.3.5 ADC2y
        1. 8.3.5.1 ADC2y Input Multiplexer
        2. 8.3.5.2 ADC2y Programmable Gain Amplifier (PGA)
        3. 8.3.5.3 ADC2y ΔΣ Modulator
        4. 8.3.5.4 ADC2y Digital Filter
        5. 8.3.5.5 ADC2y Offset and Gain Calibration
        6. 8.3.5.6 ADC2y Sequencer
        7. 8.3.5.7 VCMy Buffers
        8. 8.3.5.8 ADC2y Measurement Configurations
        9. 8.3.5.9 ADC2y Conversion Data
      6. 8.3.6 General-Purpose Digital Inputs and Outputs (GPIO0 to GPIO4)
        1. 8.3.6.1 GPIOx PWM Output Configuration
        2. 8.3.6.2 GPIOx PWM Input Readback
      7. 8.3.7 General-Purpose Digital Inputs and Outputs (GPIO0A, GPIO1A, GPIO0B, GPIO1B)
      8. 8.3.8 Monitors and Diagnostics
        1. 8.3.8.1  Supply Monitors
        2. 8.3.8.2  Clock Monitors
        3. 8.3.8.3  Digital Monitors
          1. 8.3.8.3.1 Register Map CRC
          2. 8.3.8.3.2 Memory Map CRC
          3. 8.3.8.3.3 GPIO Readback
        4. 8.3.8.4  Communication Monitors
        5. 8.3.8.5  Fault Flags and Fault Masking
        6. 8.3.8.6  FAULT Pin
        7. 8.3.8.7  Diagnostics and Diagnostic Procedure
        8. 8.3.8.8  Indicators
        9. 8.3.8.9  Conversion and Sequence Counters
        10. 8.3.8.10 Supply Voltage Readback
        11. 8.3.8.11 Temperature Sensor (TSA)
        12. 8.3.8.12 Test DACs (TDACA, TDACB)
        13. 8.3.8.13 Open-Wire Detection
        14. 8.3.8.14 Missing Host Detection and MHD Pin
        15. 8.3.8.15 Overcurrent Comparators (OCCA, OCCB)
          1. 8.3.8.15.1 OCCA and OCCB Pins
          2. 8.3.8.15.2 Overcurrent Indication Response Time
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Up and Reset
        1. 8.4.1.1 Power-On Reset (POR)
        2. 8.4.1.2 RESETn Pin
        3. 8.4.1.3 RESET Command
      2. 8.4.2 Operating Modes
        1. 8.4.2.1 Active Mode
        2. 8.4.2.2 Standby Mode
        3. 8.4.2.3 Power-Down Mode
      3. 8.4.3 ADC Conversion Modes
        1. 8.4.3.1 ADC1y Conversion Modes
          1. 8.4.3.1.1 Continuous-Conversion Mode
          2. 8.4.3.1.2 Single-Shot Conversion Mode
          3. 8.4.3.1.3 Global-Chop Mode
            1. 8.4.3.1.3.1 Overcurrent Indication Response Time in Global-Chop Mode
        2. 8.4.3.2 ADC2y Sequencer Operation and Sequence Modes
          1. 8.4.3.2.1 Continuous Sequence Mode
          2. 8.4.3.2.2 Single-Shot Sequence Mode
          3. 8.4.3.2.3 Synchronized Single-Shot Sequence Mode Based on ADC1y Conversion Starts
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Serial Interface Signals
          1. 8.5.1.1.1 Chip Select (CSn)
          2. 8.5.1.1.2 Serial Data Clock (SCLK)
          3. 8.5.1.1.3 Serial Data Input (SDI)
          4. 8.5.1.1.4 Serial Data Output (SDO)
          5. 8.5.1.1.5 Data Ready (DRDYn)
        2. 8.5.1.2 Serial Interface Communication Structure
          1. 8.5.1.2.1 SPI Communication Frames
          2. 8.5.1.2.2 SPI Communication Words
          3. 8.5.1.2.3 STATUS Word
          4. 8.5.1.2.4 Communication Cyclic Redundancy Check (CRC)
          5. 8.5.1.2.5 Commands
            1. 8.5.1.2.5.1 NULL (0000 0000 0000 0000b)
            2. 8.5.1.2.5.2 RESET (0000 0000 0001 0001b)
            3. 8.5.1.2.5.3 LOCK (0000 0101 0101 0101b)
            4. 8.5.1.2.5.4 UNLOCK (0000 0110 0101 0101b)
            5. 8.5.1.2.5.5 WREG (011a aaaa aaa0 0nnnb)
            6. 8.5.1.2.5.6 RREG (101a aaaa aaan nnnnb)
          6. 8.5.1.2.6 SCLK Counter
          7. 8.5.1.2.7 SPI Timeout
          8. 8.5.1.2.8 Reading ADC1A, ADC1B, and ADC2A Conversion Data
          9. 8.5.1.2.9 DRDYn Pin Behavior
    6. 8.6 Register Map
      1. 8.6.1 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Unused Inputs and Outputs
      2. 9.1.2 Minimum Interface Connections
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Current-Shunt Measurement
        2. 9.2.2.2 Battery-Pack Voltage Measurement
        3. 9.2.2.3 Shunt Temperature Measurement
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power-Supply Options
        1. 9.3.1.1 Single Unregulated External 4-V to 16-V Supply (3.3-V Digital I/O Levels)
        2. 9.3.1.2 Single Regulated External 3.3-V Supply (3.3-V Digital IO Levels)
        3. 9.3.1.3 Single Regulated External 5-V Supply (5-V Digital I/O Levels)
      2. 9.3.2 Power-Supply Sequencing
      3. 9.3.3 Power-Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
8.5.1.2.6 SCLK Counter

The ADS131B23 implements an SCLK counter that counts the received SCLK pulses within a frame. If the number of received SCLK pulses does not match the number of SCLKs to complete a specific frame, then the SCLK_COUNT_FAULTn flag is set in the following frame. Enable or disable the SCLK counter using the SCLK_COUNTER_EN bit.

The device determines the number of SCLKs expected for a specific SPI frame at the end of the command CRC word. Both the expected number of words to be received on SDI and the words to be transmitted on SDO are considered in the SCLK count calculation. The larger of the two values determines the SCLK count for the frame. For example, the SCLK count in the two frames in Figure 8-35 is (4 × NWORD_LENGTH), while in Figure 8-36 the SCLK count for the frame is (9 × NWORD_LENGTH). The data word length, NWORD_LENGTH, is either 24 or 32, as configured by the WORD_LENGTH bit.

Sending more SCLK pulses than required to complete a frame does not impact the SPI communication, however the SCLK_COUNT_FAULTn does still set in that case to indicate that too many SCLKs were received.

Sending insufficient SCLK pulses to complete a frame does impact the SPI communication in certain situations:

  • NULL command: No effect.
  • RESET command: Does not execute until sufficient SCLK pulses are provided to clock out the complete output CRC word on SDO.
  • LOCK, UNLOCK, RREG commands: Do execute if at least the command and command CRC words are received on SDI.
  • WREG command: Does execute if at least the command, command CRC, register data, and register data CRC words are received on SDI.
  • DRDYn pin: The DRDYn pin only transitions high after the conversion data word for ADC1B is clocked out on SDO. Otherwise, the device assumes the host did not receive the latest conversion data and the DRDYn pin stays low.