SBAS486F November   2009  – February 2016 ADS41B29 , ADS41B49

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: General
    6. 6.6  Electrical Characteristics: ADS41B29, ADS41B49
    7. 6.7  Digital Characteristics
    8. 6.8  Timing Requirements: LVDS and CMOS Modes
    9. 6.9  Timing Requirements: Reset
    10. 6.10 Timing Requirements: LVDS Timing Across Sampling Frequencies
    11. 6.11 Timing Requirements: CMOS Timing Across Sampling Frequencies
    12. 6.12 Timing Requirements: CMOS Timing Across Sampling Frequencies
    13. 6.13 Typical Characteristics: ADS41B49
    14. 6.14 Typical Characteristics: ADS41B29
    15. 6.15 Typical Characteristics: General
    16. 6.16 Typical Characteristics: Contour
  7. 7 Parameter Measurement Information
    1. 7.1 Timing Diagrams
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
      2. 8.3.2 Clock Input
      3. 8.3.3 Gain for SFDR, SNR Trade-Off
      4. 8.3.4 Offset Correction
      5. 8.3.5 Digital Output Information
        1. 8.3.5.1 Output Interface
        2. 8.3.5.2 DDR LVDS Outputs
        3. 8.3.5.3 LVDS Output Data and Clock Buffers
        4. 8.3.5.4 Parallel CMOS Interface
        5. 8.3.5.5 CMOS Interface Power Dissipation
        6. 8.3.5.6 Input Overvoltage Indication (OVR Pin)
        7. 8.3.5.7 Output Data Format
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Configuration
      2. 8.4.2 Power-Down
        1. 8.4.2.1 Power-Down Global
        2. 8.4.2.2 Standby
        3. 8.4.2.3 Output Buffer Disable
        4. 8.4.2.4 Input Clock Stop
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Register Initialization
      2. 8.5.2 Serial Register Readout
    6. 8.6 Register Maps
      1. 8.6.1 Serial Register Map
        1. 8.6.1.1 Summary of High-Performance Modes
        2. 8.6.1.2 Description of Serial Registers
          1. 8.6.1.2.1  Register Address 00h (address = 00h) [reset = 00h]
          2. 8.6.1.2.2  Register Address 01h (address = 01h) [reset = 00h]
          3. 8.6.1.2.3  Register Address 03h (address = 03h) [reset = 00h]
          4. 8.6.1.2.4  Register Address 25h (address = 25h) [reset = 50h]
          5. 8.6.1.2.5  Register Address 26h (address = 26h) [reset = 00h]
          6. 8.6.1.2.6  Register Address 3Dh (address = 3Dh) [reset = 00h]
          7. 8.6.1.2.7  Register Address 3Fh (address = 3Fh) [reset = 00h]
          8. 8.6.1.2.8  Register Address 40h (address = 40h) [reset = 00h]
          9. 8.6.1.2.9  Register Address 41h (address = 41h) [reset = 00h]
          10. 8.6.1.2.10 Register Address 42h (address = 42h) [reset = 08h]
          11. 8.6.1.2.11 Register Address 43h (address = 43h) [reset = 00h]
          12. 8.6.1.2.12 Register Address 4Ah (address = 4Ah) [reset = 00h]
          13. 8.6.1.2.13 Register Address BFh (address = BFh) [reset = 00h]
          14. 8.6.1.2.14 Register Address CFh (address = CFh) [reset = 00h]
          15. 8.6.1.2.15 Register Address DFh (address = DFh) [reset = 00h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Drive Circuit Requirements
      2. 9.1.2 Driving Circuit
  10. 10Power Supply Recommendations
    1. 10.1 Power-Supply Sequence
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Board Design Considerations
        1. 11.1.1.1 Grounding
        2. 11.1.1.2 Supply Decoupling
        3. 11.1.1.3 Exposed Pad
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

ADS4149 Data Sheet, SBAS483

ADS414x, ADS412x EVM User Guide, SLWU067

Application Note VQFN Layout Guidelines, SLOA122

Application Note VQFN/SON PCB Attachment, SLUA271

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 9. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
ADS41B29 Click here Click here Click here Click here Click here
ADS41B49 Click here Click here Click here Click here Click here

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

PowerPAD is a trademark of Texas Instruments, Incorporated.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.