SBAS621B July   2013  – September 2015 ADS42JB46

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: ADS42JB46
    6. 7.6  Electrical Characteristics: General
    7. 7.7  Timing Characteristics
    8. 7.8  Digital Characteristics
    9. 7.9  Reset Timing
    10. 7.10 Serial Interface Timing
    11. 7.11 Typical Characteristics: ADS42JB46
    12. 7.12 Typical Characteristics: Contour
      1. 7.12.1 Spurious-Free Dynamic Range (SFDR)
      2. 7.12.2 Signal-to-Noise Ratio (SNR)
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital Gain
      2. 8.3.2 Overrange Indication
      3. 8.3.3 Input Clock Divider
      4. 8.3.4 Pin Controls
    4. 8.4 Device Functional Modes
      1. 8.4.1 JESD204B Interface
        1. 8.4.1.1 JESD204B Initial Lane Alignment (ILA)
        2. 8.4.1.2 JESD204B Test Patterns
        3. 8.4.1.3 JESD204B Frame Assembly
        4. 8.4.1.4 JESD Link Configuration
          1. 8.4.1.4.1 Configuration for 2-Lane (20x) SERDES Mode
          2. 8.4.1.4.2 Configuration for 4-Lane (10x) SERDES Mode
        5. 8.4.1.5 CML Outputs
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Register Initialization
        2. 8.5.1.2 Serial Register Write
        3. 8.5.1.3 Serial Register Readout
    6. 8.6 Register Maps
      1. 8.6.1 Summary of Serial Interface Registers
      2. 8.6.2 Description of Serial Interface Registers
        1. 8.6.2.1  Register Address 06
        2. 8.6.2.2  Register Address 07
        3. 8.6.2.3  Register Address 08
        4. 8.6.2.4  Register Address 0B
        5. 8.6.2.5  Register Address 0C
        6. 8.6.2.6  Register Address 0D
        7. 8.6.2.7  Register Address 0E
        8. 8.6.2.8  Register Address 0F
        9. 8.6.2.9  Register Address 10
        10. 8.6.2.10 Register Address 11
        11. 8.6.2.11 Register Address 12
        12. 8.6.2.12 Register Address 13
        13. 8.6.2.13 Register Address 1F
        14. 8.6.2.14 Register Address 26
        15. 8.6.2.15 Register Address 27
        16. 8.6.2.16 Register Address 2B
        17. 8.6.2.17 Register Address 2C
        18. 8.6.2.18 Register Address 2D
        19. 8.6.2.19 Register Address 30
        20. 8.6.2.20 Register Address 36
        21. 8.6.2.21 Register Address 37
        22. 8.6.2.22 Register Address 38
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Analog Input
          1. 9.2.2.1.1 Drive Circuit Requirements
          2. 9.2.2.1.2 Driving Circuit
        2. 9.2.2.2 Clock Input
        3. 9.2.2.3 SNR and Clock Jitter
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.