SLAS605C June   2008  – July 2018 ADS7950 , ADS7951 , ADS7952 , ADS7953 , ADS7954 , ADS7955 , ADS7956 , ADS7957 , ADS7958 , ADS7959 , ADS7960 , ADS7961

PRODUCTION DATA.  

  1. Features
  2. Applications
    1.     Detailed Block Diagram
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions: TSSOP Packages
    2.     Pin Functions: VQFN Packages
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: TSSOP
    5. 7.5  Thermal Information: VQFN
    6. 7.6  Electrical Characteristics: ADS7950, ADS7951, ADS7952, ADS7953
    7. 7.7  Electrical Characteristics, ADS7954, ADS7955, ADS7956, ADS7957
    8. 7.8  Electrical Characteristics, ADS7958, ADS7959, ADS7960, ADS7961
    9. 7.9  Timing Requirements
    10. 7.10 Typical Characteristics (All ADS79xx Family Devices)
    11. 7.11 Typical Characteristics (12-Bit Devices Only)
    12. 7.12 Typical Characteristics (12-Bit Devices Only)
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Reference
      2. 8.3.2 Power Saving
    4. 8.4 Device Functional Modes
      1. 8.4.1 Channel Sequencing Modes
      2. 8.4.2 Device Programming and Mode Control
        1. 8.4.2.1 Mode Control Register
        2. 8.4.2.2 Program Registers
      3. 8.4.3 Device Power-Up Sequence
      4. 8.4.4 Operating in Manual Mode
      5. 8.4.5 Operating in Auto-1 Mode
      6. 8.4.6 Operating in Auto-2 Mode
      7. 8.4.7 Continued Operation in a Selected Mode
    5. 8.5 Programming
      1. 8.5.1 Digital Output
      2. 8.5.2 GPIO Registers
      3. 8.5.3 Alarm Thresholds for GPIO Pins
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Analog Input
    2. 9.2 Typical Applications
      1. 9.2.1 Unbuffered Multiplexer Output (MXO)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 OPA192 Buffered Multiplexer Output (MXO)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGE|24
  • DBT|30
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Design Procedure

Although the required input source impedance can be estimated assuming a 0.5-V initial error and exponential recovery during sampling (acquisition) time, this estimation over-simplifies the complex interaction between the converter and source, thus yielding inaccurate estimates. Thus, this design uses an iterative approach with the converter itself to provide reliable impedance values.

To determine the actual maximum source impedance for a particular resolution and sampling rate, two subsequent channels are set at least 95% of the full-scale range apart. With a 1xVREF range and 2.5 VREF, the channel difference is at least 2.375 V. With 2xVREF and 2.5 VREF, the difference is at least 4.75 V. With a source impedance from 100 Ω to 10,000 Ω, the conversion runs at a constant rate and a channel update is issued that captures the first couple samples after the update. This process is repeated at least 100 times to remove any noise and to show a clear settling error. The first sample after the channel update is then compared against the second one. If the first and second samples are more than 1 LSB apart, throughput rate is reduced until the settling error becomes 1 LSB, which then sets the maximum throughput for the selected impedance. The whole process is repeated for nine different impedances from 100 Ω to 10000 Ω.