SBAS729C June   2016  – August 2026 ADS8920B , ADS8922B , ADS8924B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 LDO Module
      2. 6.3.2 Reference Buffer Module
      3. 6.3.3 Converter Module
        1. 6.3.3.1 Sample-and-Hold Circuit
        2. 6.3.3.2 Internal Oscillator
        3. 6.3.3.3 ADC Transfer Function
      4. 6.3.4 Interface Module
    4. 6.4 Device Functional Modes
      1. 6.4.1 RST State
      2. 6.4.2 ACQ State
      3. 6.4.3 CNV State
    5. 6.5 Programming
      1. 6.5.1 Output Data Word
      2. 6.5.2 Data Transfer Frame
      3. 6.5.3 Interleaving Conversion Cycles and Data Transfer Frames
      4. 6.5.4 Data Transfer Protocols
        1. 6.5.4.1 Protocols for Configuring the Device
        2. 6.5.4.2 Protocols for Reading From the Device
          1. 6.5.4.2.1 Legacy, SPI-Compatible (SYS-xy-S) Protocols
          2. 6.5.4.2.2 SPI-Compatible Protocols with Bus Width Options
          3. 6.5.4.2.3 Source-Synchronous (SRC) Protocols
            1. 6.5.4.2.3.1 Output Clock Source Options with SRC Protocols
            2. 6.5.4.2.3.2 Bus Width Options With SRC Protocols
            3. 6.5.4.2.3.3 Output Data Rate Options With SRC Protocols
      5. 6.5.5 Device Setup
        1. 6.5.5.1 Single Device: All multiSPI Options
        2. 6.5.5.2 Single Device: Minimum Pins for a Standard SPI
        3. 6.5.5.3 Multiple Devices: Daisy-Chain Topology
        4. 6.5.5.4 Multiple Devices: Star Topology
  8. 7 Register Maps
    1. 7.1 Device Configuration and Register Maps
      1. 7.1.1 PD_CNTL Register (address = 04h) [reset = 08h]
      2. 7.1.2 SDI_CNTL Register (address = 008h) [reset = 00h]
      3. 7.1.3 SDO_CNTL Register (address = 0Ch) [reset = 00h]
      4. 7.1.4 DATA_CNTL Register (address = 010h) [reset = 00h]
      5. 7.1.5 PATN_LSB Register (address = 014h) [reset = 00h]
      6. 7.1.6 PATN_MID Register (address = 015h) [reset = 00h]
      7. 7.1.7 PATN_MSB Register (address = 016h) [reset = 00h]
      8. 7.1.8 OFST_CAL Register (address = 020h) [reset = 00h]
      9. 7.1.9 REF_MRG Register (address = 030h) [reset = 00h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ADC Reference Driver
      2. 8.1.2 ADC Input Driver
        1. 8.1.2.1 Charge-Kickback Filter
        2. 8.1.2.2 Input Amplifier Selection
    2. 8.2 Typical Application
      1. 8.2.1 Data Acquisition (DAQ) Circuit for Lowest Distortion and Noise Performance With Differential Input
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DAQ Circuit With FDA Input Driver and Single-Ended or Differential Input
      3. 8.2.3 Design Requirements
      4. 8.2.4 Detailed Design Procedure
      5. 8.2.5 Application Curves
    3. 8.3 Power-Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Signal Path
        2. 8.4.1.2 Grounding and PCB Stack-Up
        3. 8.4.1.3 Decoupling of Power Supplies
        4. 8.4.1.4 Reference Decoupling
        5. 8.4.1.5 Differential Input Decoupling
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

5.6 Timing Requirements

MINTYPMAXUNITTIMING DIAGRAM
CONVERSION CYCLE
fcycleSampling frequency ADS8920B1000kHzFigure 5-1
ADS8922B 500
ADS8924B 250
tcycleADC cycle-time period ADS8920B1µs
ADS8922B 2
ADS8924B 4
twh_CONVSTPulse duration: CONVST high30ns
twl_CONVSTPulse duration: CONVST low30ns
tacqAcquisition time300ns
tqt_acqQuiet acquisition time30nsFigure 6-15, see Section 6.5.4
td_cnvcapQuiet aperture time20ns
ASYNCHRONOUS RESET, AND LOW POWER MODES
twl_RSTPulse duration: RST low100nsFigure 5-2
SPI-COMPATIBLE SERIAL INTERFACE
fCLKSerial clock frequency2.35V ≤ DVDD ≤ 5.5V,
TA = –40°C to +125°C,
VIH > 0.7 DVDD, VIL < 0.3DVDD		70MHzFigure 5-3
1.65V ≤ DVDD < 2.35V,
TA = –40°C to +125°C,
VIH > 0.8 DVDD, VIL < 0.2DVDD		20
1.65V ≤ DVDD < 2.35V,
TA = 0°C to +60°C,
VIH > 0.8 DVDD, VIL < 0.2DVDD		57
1.65V ≤ DVDD < 2.35V,
TA = –40°C to +125°C,
VIH > 0.9 DVDD, VIL < 0.1DVDD		68
1.71V ≤ DVDD < 1.89V,
TA = +20°C to +90°C,
VIH > 0.75 DVDD, VIL < 0.25 DVDD		 52
tCLKSerial clock time period1/fCLKnsFigure 5-3
tph_CKSCLK high time0.450.55tCLKFigure 5-3
tpl_CKSCLK low time0.450.55tCLK
tsu_CSCKSetup time: CS falling to the first SCLK capture edge12ns
tsu_CKDISetup time: SDI data valid to the SCLK capture edge1.5ns
tht_CKDIHold time: SCLK capture edge to (previous) data valid on SDI1ns
tht_CKCSDelay time: last SCLK falling to CS rising7ns
SOURCE-SYNCHRONOUS SERIAL INTERFACE (External Clock)(1)
fCLKSerial clock frequencySDR (DATA_RATE = 0b),
2.35V ≤ DVDD ≤ 5.5V		70MHzFigure 5-4, see Section 6.5.4
DDR (DATA_RATE = 1b),
2.35V ≤ DVDD ≤ 5.5V		35
tCLKSerial clock time period1/fCLKns
(1) The external clock option is not recommended when operating with DVDD < 2.35V. See Table 6-9.