SBASAX3A May   2025  – September 2025 ADS9326 , ADS9327

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Electrical Characteristics 
    6. 6.6  Electrical Characteristics: AVDD = 5V
    7. 6.7  Electrical Characteristics: AVDD = 3.3V
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Timing Diagrams
    11. 6.11 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
      2. 7.3.2 Reference
        1. 7.3.2.1 Internal Reference
          1. 7.3.2.1.1 Selectable Internal Reference with 5V AVDD
        2. 7.3.2.2 External Reference
        3. 7.3.2.3 External Reference With External Reference Buffer
      3. 7.3.3 ADC Transfer Function
      4. 7.3.4 Data Interface
      5. 7.3.5 Programmable Data Averaging Filter
        1. 7.3.5.1 Simple Average
          1. 7.3.5.1.1 Simple Average with Noncontinuous CONVST
        2. 7.3.5.2 Moving Average
      6. 7.3.6 CRC on Output Data Interface
      7. 7.3.7 ADC Output Data Randomizer
      8. 7.3.8 Data Frame Width
      9. 7.3.9 Daisy-Chain Mode
        1. 7.3.9.1 Daisy-Clock Mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset
      2. 7.4.2 Normal Operation
      3. 7.4.3 Low-Latency Mode
      4. 7.4.4 CS-CONVST Short Mode
      5. 7.4.5 Register Read Mode
      6. 7.4.6 Initialization Sequence
    5. 7.5 Programming
      1. 7.5.1 SPI Frame Length for Register Operations
      2. 7.5.2 Register Map Lock
      3. 7.5.3 Register Write
      4. 7.5.4 Register Read
  9. 8 Register Map: ADS9327
    1. 8.1 Register Bank 0
    2. 8.2 Register Bank 1
    3. 8.3 Register Bank 2
  10. 9 Register Map: ADS9326
    1. 9.1 Register Bank 0
    2. 9.2 Register Bank 1
    3. 9.3 Register Bank 2
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Analog 1VPP Sine-Cosine Encoder Interface
      2. 10.2.2 Design Requirements
      3. 10.2.3 Detailed Design Procedure
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
  • VAE|22
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.4.1 Layout Guidelines

Figure 10-3 illustrates a board layout example for the ADS932x. Avoid crossing digital lines with the analog signal path and keep the analog input signals and the reference signals away from noise sources. Use 1μF ceramic bypass capacitors in close proximity to the analog (AVDD and VDD_1V8), and digital (IOVDD) power-supply pins. Avoid placing vias between the power-supply pins and bypass capacitors. Place the reference decoupling capacitor close to the device REF_CAP and REFM pins. Avoid placing vias between the REFIO pin and the bypass capacitors. Connect the GND and REFM pins to a ground plane using short, low-impedance paths.