SWRS236C March   2021  – January 2024 AWR1843AOP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
    3. 5.3 Signal Descriptions
      1. 5.3.1 Pin Functions - Digital and Analog [ALP Package]
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Power-On Hours (POH)
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Power Supply Specifications
    6. 6.6  Power Consumption Summary
    7. 6.7  RF Specification
    8. 6.8  CPU Specifications
    9. 6.9  Thermal Resistance Characteristics for FCBGA Package [ALP0180A]
    10. 6.10 Timing and Switching Characteristics
      1. 6.10.1  Antenna Radiation Patterns
        1. 6.10.1.1 Antenna Radiation Patterns for Receiver
        2. 6.10.1.2 Antenna Radiation Patterns for Transmitter
      2. 6.10.2  Antenna Positions
      3. 6.10.3  Power Supply Sequencing and Reset Timing
      4. 6.10.4  Input Clocks and Oscillators
        1. 6.10.4.1 Clock Specifications
      5. 6.10.5  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 6.10.5.1 Peripheral Description
        2. 6.10.5.2 MibSPI Transmit and Receive RAM Organization
          1. 6.10.5.2.1 SPI Timing Conditions
          2. 6.10.5.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. 6.10.5.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
        3. 6.10.5.3 SPI Peripheral Mode I/O Timings
          1. 6.10.5.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        4. 6.10.5.4 Typical Interface Protocol Diagram (Slave Mode)
      6. 6.10.6  LVDS Interface Configuration
        1. 6.10.6.1 LVDS Interface Timings
      7. 6.10.7  General-Purpose Input/Output
        1. 6.10.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) #GUID-4685AB93-A014-47EA-9F05-952FFC28DBFA/T4362547-45 #GUID-4685AB93-A014-47EA-9F05-952FFC28DBFA/T4362547-50
      8. 6.10.8  Controller Area Network Interface (DCAN)
        1. 6.10.8.1 Dynamic Characteristics for the DCANx TX and RX Pins
      9. 6.10.9  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 6.10.9.1 Dynamic Characteristics for the CANx TX and RX Pins
      10. 6.10.10 Serial Communication Interface (SCI)
        1. 6.10.10.1 SCI Timing Requirements
      11. 6.10.11 Inter-Integrated Circuit Interface (I2C)
        1. 6.10.11.1 I2C Timing Requirements #GUID-64613E7E-5DDF-4B01-8FA0-13739060F368/T4362547-185
      12. 6.10.12 Quad Serial Peripheral Interface (QSPI)
        1. 6.10.12.1 QSPI Timing Conditions
        2. 6.10.12.2 Timing Requirements for QSPI Input (Read) Timings #GUID-6A95C194-2C40-46FE-9793-4574200DA2C4/T4362547-210 #GUID-6A95C194-2C40-46FE-9793-4574200DA2C4/T4362547-209
        3. 6.10.12.3 QSPI Switching Characteristics
      13. 6.10.13 ETM Trace Interface
        1. 6.10.13.1 ETMTRACE Timing Conditions
        2. 6.10.13.2 ETM TRACE Switching Characteristics
      14. 6.10.14 Data Modification Module (DMM)
        1. 6.10.14.1 DMM Timing Requirements
      15. 6.10.15 JTAG Interface
        1. 6.10.15.1 JTAG Timing Conditions
        2. 6.10.15.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 6.10.15.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Subsystems
      1. 7.3.1 RF and Analog Subsystem
        1. 7.3.1.1 Clock Subsystem
        2. 7.3.1.2 Transmit Subsystem
        3. 7.3.1.3 Receive Subsystem
      2. 7.3.2 Processor Subsystem
      3. 7.3.3 Automotive Interface
      4. 7.3.4 Main Subsystem Cortex-R4F Memory Map
      5. 7.3.5 DSP Subsystem Memory Map
    4. 7.4 Other Subsystems
      1. 7.4.1 ADC Channels (Service) for User Application
        1. 7.4.1.1 GP-ADC Parameter
  9. 8 Monitoring and Diagnostics
    1. 8.1 Monitoring and Diagnostic Mechanisms
      1. 8.1.1 Error Signaling Module
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
    2. 9.2 Reference Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALP|180
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Power-On Hours (POH)

JUNCTION TEMPERATURE (Tj)(1)(2)OPERATING CONDITIONNOMINAL CVDD VOLTAGE (V)POWER-ON HOURS [POH] (HOURS)
–40°C100% duty cycle1.2600 (6%)
75°C2000 (20%)
95°C6500 (65%)
125°C900 (9%)
(1) This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's standard terms and conditions for TI semiconductor products.
(2) The specified POH are applicable with max Tx output power settings using the default firmware gain tables. The specified POH would not be applicable, if the Tx gain table is overwritten using an API.