SLUS694G March   2006  – December 2014

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Path Management
        1. 8.3.1.1 Case 1: IN Mode (Mode = High)
          1. 8.3.1.1.1 System Power
          2. 8.3.1.1.2 Charge Control
          3. 8.3.1.1.3 Dynamic Power-Path Management (DPPM)
        2. 8.3.1.2 Case 2: USB Mode (Mode = L)
          1. 8.3.1.2.1 System Power
          2. 8.3.1.2.2 Charge Control
          3. 8.3.1.2.3 Dynamic Power-Path Management (DPPM)
          4. 8.3.1.2.4 Application Curve Descriptions
      2. 8.3.2 Battery Temperature Monitoring
      3. 8.3.3 Charge Status Outputs
      4. 8.3.4 PG, Outputs (Power Good)
      5. 8.3.5 Short-Circuit Recovery
      6. 8.3.6 VREF
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode - V(IN) < VI(BAT)
      2. 8.4.2 Standy Mode - V(IN) > VI(BAT)and CE (Chip Enable) Pin = Low
      3. 8.4.3 Battery Charge Mode - V(IN) > VI(BAT), Battery Present, CE pin = High and DPPM Pin Not Floating
        1. 8.4.3.1 Automous Power Selection and Boot-Up Sequence
        2. 8.4.3.2 Charge Control
        3. 8.4.3.3 Battery Preconditioning
        4. 8.4.3.4 Battery Charge Current
        5. 8.4.3.5 Battery Voltage Regulation
        6. 8.4.3.6 Temperature Regulation and Thermal Protection
        7. 8.4.3.7 Charge Timer Operation
        8. 8.4.3.8 Timer Fault Recovery
        9. 8.4.3.9 Charge Termination and Recharge
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting the Input and Output Capacitors
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHL|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison Table

PART
NUMBER(1)		 TA BATTERY
VOLTAGE (V)		 OUT PIN STATUS PACKAGE
MARKING
bq24070 –40°C to 125°C 4.2 Regulated to 4.4 V(2) Production BRQ
bq24071 Regulated to 6 V BTR
(1) This product is RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and is suitable for use in specified lead-free soldering processes. In addition, this product uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(2) If IN < VO(OUT-REG), the IN is connected to the OUT pin by a P-FET, (Q1).