SLUS977B September   2009  – August 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Overvoltage Protection
      2. 8.3.2 Input Overcurrent Protection
      3. 8.3.3 Battery Overvoltage Protection
      4. 8.3.4 Thermal Protection
      5. 8.3.5 Enable Function
      6. 8.3.6 PGATE Output
    4. 8.4 Device Functional Modes
      1. 8.4.1 OPERATION Mode
      2. 8.4.2 POWER-DOWN Mode
      3. 8.4.3 POWER-ON RESET Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selection of RBAT
        2. 9.2.2.2 Selection of RCE
        3. 9.2.2.3 Selection of Input and Output Bypass Capacitors
        4. 9.2.2.4 Selection of the PGATE External MOSFET
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (November 2009) to B Revision

  • Changed SON to WSON throughout the document Go
  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go
  • Changed the location of the ESD information from the ABS MAX table to the news ESD Ratings table Go
  • Moved Figures 1 through 10 from Typical Characteristics to Application Curves section Go

Changes from * Revision (September 2009) to A Revision

  • Changed Units from V to A for Input and Output Current spec in Absolute Maximum Ratings table.Go
  • Changed VO(REG) test condition, IOUT value from 50 mA to 250 mAGo
  • Added TJ = 0°C to 125°C to test conditions for IOCP spec.Go
  • Changed QEXT device symbol in the Input Reverse-Polarity Protection schematic. Go