SLUSBU6B September   2014  – January 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2  Applications
  3. 3  Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Supply Current
    6. 6.6  Digital Input and Output DC Electrical Characteristics
    7. 6.7  Power-on Reset
    8. 6.8  2.5-V LDO Regulator
    9. 6.9  Internal Clock Oscillators
    10. 6.10 ADC (Temperature and Cell Measurement) Characteristics
    11. 6.11 Integrating ADC (Coulomb Counter) Characteristics
    12. 6.12 Data Flash Memory Characteristics
    13. 6.13 I2C-compatible Interface Communication Timing Requirements
    14. 6.14 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Functional Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
      2. 7.4.2 BAT INSERT CHECK Mode
      3. 7.4.3 NORMAL Mode
      4. 7.4.4 SLEEP Mode
      5. 7.4.5 SLEEP+ Mode
      6. 7.4.6 HIBERNATE Mode
    5. 7.5 Programming
      1. 7.5.1 Standard Data Commands
      2. 7.5.2 Control( ): 0x00 and 0x01
      3. 7.5.3 Charger Data Commands
      4. 7.5.4 Communications
        1. 7.5.4.1 I2C Interface
        2. 7.5.4.2 I2C Time Out
        3. 7.5.4.3 I2C Command Waiting Time
        4. 7.5.4.4 I2C Clock Stretching
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 BAT Voltage Sense Input
        2. 8.2.2.2 SRP and SRN Current Sense Inputs
        3. 8.2.2.3 Sense Resistor Selection
        4. 8.2.2.4 TS Temperature Sense Input
        5. 8.2.2.5 Thermistor Selection
        6. 8.2.2.6 REGIN Power Supply Input Filtering
        7. 8.2.2.7 VCC LDO Output Filtering
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Sense Resistor Connections
      2. 10.1.2 Thermistor Connections
      3. 10.1.3 High-Current and Low-Current Path Separation
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.