SLUSF37 December   2022 BQ34Z100-R2

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Power-On Reset
    6. 6.6  Electrical Characteristics: LDO Regulator
    7. 6.7  Electrical Characteristics: Internal Temperature Sensor Characteristics
    8. 6.8  Electrical Characteristics: Low-Frequency Oscillator
    9. 6.9  Electrical Characteristics: High-Frequency Oscillator
    10. 6.10 Electrical Characteristics: Integrating ADC (Coulomb Counter) Characteristics
    11. 6.11 Electrical Characteristics: ADC (Temperature and Cell Measurement) Characteristics
    12. 6.12 Electrical Characteristics: Data Flash Memory Characteristics
    13. 6.13 Timing Requirements: HDQ Communication
    14. 6.14 Timing Requirements: I2C-Compatible Interface
    15. 6.15 Typical Characteristics
  7. 7 Functional Block Diagram
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Step-by-Step Design Procedure
          1. 8.2.2.1.1 STEP 1: Review and Modify the Data Flash Configuration Data.
          2. 8.2.2.1.2 STEP 2: Review and Modify the Data Flash Configuration Registers.
          3. 8.2.2.1.3 STEP 3: Design and Configure the Voltage Divider.
          4. 8.2.2.1.4 STEP 4: Determine the Sense Resistor Value.
          5. 8.2.2.1.5 STEP 5: Review and Modify the Data Flash Gas Gauging Configuration, Data, and State.
          6. 8.2.2.1.6 STEP 6: Determine and Program the Chemical ID.
          7. 8.2.2.1.7 STEP 7: Calibrate.
          8. 8.2.2.1.8 STEP 8: Run an Optimization Cycle.
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Introduction
      2. 10.1.2 Power Supply Decoupling Capacitor
      3. 10.1.3 Capacitors
      4. 10.1.4 Communication Line Protection Components
    2. 10.2 Layout Example
      1. 10.2.1 Ground System
      2. 10.2.2 Kelvin Connections
      3. 10.2.3 Board Offset Considerations
      4. 10.2.4 ESD Spark Gap
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Recommended Operating Conditions

TA =–40°C to 85°C; Typical Values at TA = 25°C CLDO25 = 1.0 µF, and VREGIN = 3.6 V (unless otherwise noted)

MINNOMMAXUNIT
VREGINSupply VoltageNo operating restrictions2.74.5V
No FLASH writes2.452.7V
CREGINExternal input capacitor for internal LDO between REGIN and VSSNominal capacitor values specified. Recommend a 10% ceramic X5R type capacitor located close to the device.0.1μF
CLDO25External output capacitor for internal LDO between VCC and VSS0.471μF
ICCNORMAL operating-mode currentGas Gauge in NORMAL mode,
ILOAD > Sleep Current		145μA
ISLPSLEEP operating-mode currentGas Gauge in SLEEP mode,
ILOAD < Sleep Current		84μA
ISLP+FULLSLEEP operating-mode currentGas Gauge in FULL SLEEP mode,
ILOAD < Sleep Current		30μA
VOLOutput voltage, low (SCL, SDA, HDQ, VEN)IOL = 3 mA0.4V
VOH(PP)Output voltage, highIOH = –1 mAVCC – 0.5V
VOH(OD)Output voltage, high (SDA, SCL, HDQ, VEN)External pull-up resistor connected to VCCVCC – 0.5V
VILInput voltage, low–0.30.6V
VIH(OD)Input voltage, high (SDA, SCL, HDQ)1.26V
VA1Input voltage range (TS)VSS – 0.051V
VA2Input voltage range (BAT)VSS – 0.1255V
VA3Input voltage range (SRP, SRN)VSS – 0.1250.125V
ILKGInput leakage current (I/O pins)0.3μA
tPUCDPower-up communication delay250ms