SLUSF37 December   2022 BQ34Z100-R2

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Power-On Reset
    6. 6.6  Electrical Characteristics: LDO Regulator
    7. 6.7  Electrical Characteristics: Internal Temperature Sensor Characteristics
    8. 6.8  Electrical Characteristics: Low-Frequency Oscillator
    9. 6.9  Electrical Characteristics: High-Frequency Oscillator
    10. 6.10 Electrical Characteristics: Integrating ADC (Coulomb Counter) Characteristics
    11. 6.11 Electrical Characteristics: ADC (Temperature and Cell Measurement) Characteristics
    12. 6.12 Electrical Characteristics: Data Flash Memory Characteristics
    13. 6.13 Timing Requirements: HDQ Communication
    14. 6.14 Timing Requirements: I2C-Compatible Interface
    15. 6.15 Typical Characteristics
  7. 7 Functional Block Diagram
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Step-by-Step Design Procedure
          1. 8.2.2.1.1 STEP 1: Review and Modify the Data Flash Configuration Data.
          2. 8.2.2.1.2 STEP 2: Review and Modify the Data Flash Configuration Registers.
          3. 8.2.2.1.3 STEP 3: Design and Configure the Voltage Divider.
          4. 8.2.2.1.4 STEP 4: Determine the Sense Resistor Value.
          5. 8.2.2.1.5 STEP 5: Review and Modify the Data Flash Gas Gauging Configuration, Data, and State.
          6. 8.2.2.1.6 STEP 6: Determine and Program the Chemical ID.
          7. 8.2.2.1.7 STEP 7: Calibrate.
          8. 8.2.2.1.8 STEP 8: Run an Optimization Cycle.
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Introduction
      2. 10.1.2 Power Supply Decoupling Capacitor
      3. 10.1.3 Capacitors
      4. 10.1.4 Communication Line Protection Components
    2. 10.2 Layout Example
      1. 10.2.1 Ground System
      2. 10.2.2 Kelvin Connections
      3. 10.2.3 Board Offset Considerations
      4. 10.2.4 ESD Spark Gap
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.