SWRS256A March   2022  – April 2025 CC1311R3

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package (Top View)
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Pin Diagram—RKP Package (Top View)
    4. 6.4 Signal Descriptions—RKP Package
    5. 6.5 Connections for Unused Pins and Modules
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Supply and Modules
    5. 7.5  Power Consumption - Power Modes
    6. 7.6  Power Consumption - Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 861MHz to 1054MHz—Receive (RX)
    11. 7.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 7.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 7.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 7.14 359MHz to 527MHz—Receive (RX)
    15. 7.15 359 MHz to 527 MHz - Transmit (TX) 
    16. 7.16 359 MHz to 527 MHz - PLL Phase Noise
    17. 7.17 Timing and Switching Characteristics
      1. 7.17.1 Reset Timing
      2. 7.17.2 Wakeup Timing
      3. 7.17.3 Clock Specifications
        1. 7.17.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 7.17.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 7.17.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
        4. 7.17.3.4 32 kHz RC Oscillator (RCOSC_LF)
      4. 7.17.4 Synchronous Serial Interface (SSI) Characteristics
        1. 7.17.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       40
      5. 7.17.5 UART
        1. 7.17.5.1 UART Characteristics
    18. 7.18 Peripheral Characteristics
      1. 7.18.1 ADC
        1. 7.18.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.18.2 DAC
        1. 7.18.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.18.3 Temperature and Battery Monitor
        1. 7.18.3.1 Temperature Sensor
        2. 7.18.3.2 Battery Monitor
      4. 7.18.4 Comparator
        1. 7.18.4.1 Continuous Time Comparator
      5. 7.18.5 GPIO
        1. 7.18.5.1 GPIO DC Characteristics
    19. 7.19 Typical Characteristics
      1. 7.19.1 MCU Current
      2. 7.19.2 RX Current
      3. 7.19.3 TX Current
      4. 7.19.4 RX Performance
      5. 7.19.5 TX Performance
      6. 7.19.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Proprietary Radio Formats
    4. 8.4  Memory
    5. 8.5  Cryptography
    6. 8.6  Timers
    7. 8.7  Serial Peripherals and I/O
    8. 8.8  Battery and Temperature Monitor
    9. 8.9  Voltage Supply Domains
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
  • RKP|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Connections for Unused Pins and Modules

Table 6-3 Connections for Unused Pins—RGZ Package
FUNCTIONSIGNAL NAMEPIN NUMBERACCEPTABLE PRACTICE(1)PREFERRED
PRACTICE(1)
GPIODIO_n 6–12
14–21
26–32
36–43 		NC or GNDNC
32.768kHz crystalX32K_Q1 4 NC or GNDNC
X32K_Q2 5
DC/DC converter(2)DCDC_SW33NCNC
VDDS_DCDC34VDDSVDDS
(1) NC = No connect
(2) When the DC/DC converter is not used, the inductor between DCDC_SW and VDDR can be removed. VDDR and VDDR_RF must still be connected and the 22μF DCDC capacitor must be kept on the VDDR net.
Table 6-4 Connection for Unused Pins and Modules—RKP Package
FUNCTIONSIGNAL NAMEPIN NUMBERACCEPTABLE PRACTICEPREFERRED PRACTICE
GPIODIO_n6-12
14-15
20-24
28-35
NC or GNDNC
32.768kHz crystalX32K_Q13NC or GNDNC
X32K_Q24
No ConnectsNC NCNC
DC/DC converterDCDC_SW25NCNC
VDDS_DCDC26VDDSVDDS