SWRS253 May   2021 CC2652R7

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
    1. 3.1 Functional Block Diagram
  4. Revision History
  5. Device Comparison
  6. Terminal Configuration and Functions
    1. 6.1 Pin Diagram – RGZ Package (Top View)
    2. 6.2 Signal Descriptions – RGZ Package
    3. 6.3 Connections for Unused Pins and Modules
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Supply and Modules
    5. 7.5  Power Consumption - Power Modes
    6. 7.6  Power Consumption - Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 Bluetooth Low Energy - Receive (RX)
    11. 7.11 Bluetooth Low Energy - Transmit (TX)
    12. 7.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    13. 7.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    14. 7.14 Timing and Switching Characteristics
      1. 7.14.1 Reset Timing
      2. 7.14.2 Wakeup Timing
      3. 7.14.3 Clock Specifications
        1. 7.14.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 7.14.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 7.14.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 7.14.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 7.14.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 7.14.4 Synchronous Serial Interface (SSI) Characteristics
        1. 7.14.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.      
      5. 7.14.5 UART
        1. 7.14.5.1 UART Characteristics
    15. 7.15 Peripheral Characteristics
      1. 7.15.1 ADC
        1. 7.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.15.2 DAC
        1. 7.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.15.3 Temperature and Battery Monitor
        1. 7.15.3.1 Temperature Sensor
        2. 7.15.3.2 Battery Monitor
      4. 7.15.4 Comparators
        1. 7.15.4.1 Low-Power Clocked Comparator
        2. 7.15.4.2 Continuous Time Comparator
      5. 7.15.5 Current Source
        1. 7.15.5.1 Programmable Current Source
      6. 7.15.6 GPIO
        1. 7.15.6.1 GPIO DC Characteristics
    16. 7.16 Typical Characteristics
      1. 7.16.1 MCU Current
      2. 7.16.2 RX Current
      3. 7.16.3 TX Current
      4. 7.16.4 RX Performance
      5. 7.16.5 TX Performance
      6. 7.16.6 ADC Performance
  8. Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth 5.2 Low Energy
      2. 8.3.2 802.15.4 (Thread, Zigbee, 6LoWPAN)
    4. 8.4  Memory
    5. 8.5  Sensor Controller
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Serial Peripherals and I/O
    9. 8.9  Battery and Temperature Monitor
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  9. Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  10. 10Device and Documentation Support
    1. 10.1 Tools and Software
      1. 10.1.1 SimpleLink™ Microcontroller Platform
    2. 10.2 Documentation Support
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Microcontroller
    • Powerful 48-MHz Arm®Cortex®-M4F processor
    • EEMBC CoreMark® score: 148
    • 704KB of in-system programmable flash
    • 256KB of ROM for protocols and library functions
    • 8KB of cache SRAM (alternatively available as general-purpose RAM)
    • 144KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-Pin cJTAG and JTAG debugging
    • Supports over-the-air upgrade (OTA)
  • Ultra-low power sensor controller with 4KB of SRAM
    • Sample, store, and process sensor data
    • Operation independent from system CPU
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth® 5.2 Low Energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
  • RoHS-compliant package
    • 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
  • Peripherals
    • Digital peripherals can be routed to any GPIO
    • Four 32-bit or eight 16-bit general-purpose timers
    • 12-bit ADC, 200k samples per second, 8 channels
    • Two comparators with internal reference DAC
      (one continuous time, one ultra-low power)
    • Programmable current source
    • Two UART
    • Two SSI (SPI, MICROWIRE, TI)
    • I2C
    • I2S
    • Real-time clock (RTC)
    • AES 128- and 256-bit crypto accelerator
    • ECC and RSA public key hardware Accelerator
    • SHA2 Accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • On-chip buck DC/DC converter
  • Low power
    • Wide supply voltage range: 1.8 V to 3.8 V
    • Active mode RX: 7.1 mA
    • Active mode TX 0 dBm: 7.6 mA
    • Active mode TX 5 dBm: 9.9 mA
    • Active mode MCU 48 MHz (CoreMark):
      3.87 mA (81 μA/MHz)
    • Sensor controller, low-power mode, 2 MHz, running infinite loop: 30.1 μA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808 μA
    • Standby: 1.15 µA (RTC on, 144KB RAM and CPU retention)
    • Shutdown: 151 nA (wakeup on external events)
  • Radio section
    • 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
    • Excellent receiver sensitivity:
      -100 dBm for 802.15.4 (2.4 GHz),
      -104 dBm for Bluetooth 125-kbps (LE Coded PHY)
    • Output power up to +5 dBm with temperature compensation
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • EN 300 328, (Europe)
      • EN 300 440 Category 2
      • FCC CFR47 Part 15
      • ARIB STD-T66 (Japan)
  • Wireless protocols
    • Thread, Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), Wi-SUN®, proprietary systems, SimpleLink™ TI 15.4-stack (2.4 GHz), and dynamic multiprotocol manager (DMM) driver.
  • Development Tools and Software