SWRS243B February   2020  – May 2021 CC3235MODAS , CC3235MODASF , CC3235MODS , CC3235MODSF

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3235MODx and CC3235MODAx Pin Diagram
    2. 7.2 Pin Attributes and Pin Multiplexing
      1. 7.2.1 Module Pin Descriptions
    3. 7.3 Signal Descriptions
    4. 7.4 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    5. 7.5 Pad State After Application of Power to Chip, but Before Reset Release
    6. 7.6 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption (CC3235MODS and CC3235MODAS)
      1.      21
      2.      22
    5. 8.5  Current Consumption (CC3235MODSF and CC3235MODASF)
      1.      24
      2.      25
    6. 8.6  TX Power Control for 2.4 GHz Band
    7. 8.7  TX Power Control for 5 GHz
    8. 8.8  Brownout and Blackout Conditions
    9. 8.9  Electrical Characteristics for GPIO Pins
      1. 8.9.1 Electrical Characteristics for Pin Internal Pullup and Pulldown (25°C)
    10. 8.10 CC3235MODAx Antenna Characteristics
    11. 8.11 WLAN Receiver Characteristics
      1.      33
      2.      34
    12. 8.12 WLAN Transmitter Characteristics
      1.      36
      2.      37
    13. 8.13 BLE and WLAN Coexistence Requirements
    14. 8.14 Reset Requirement
    15. 8.15 Thermal Resistance Characteristics for MOB and MON Packages
    16. 8.16 Timing and Switching Characteristics
      1. 8.16.1 Power-Up Sequencing
      2. 8.16.2 Power-Down Sequencing
      3. 8.16.3 Device Reset
      4. 8.16.4 Wake Up From Hibernate Timing
      5. 8.16.5 Peripherals Timing
        1. 8.16.5.1  SPI
          1. 8.16.5.1.1 SPI Master
          2. 8.16.5.1.2 SPI Slave
        2. 8.16.5.2  I2S
          1. 8.16.5.2.1 I2S Transmit Mode
          2. 8.16.5.2.2 I2S Receive Mode
        3. 8.16.5.3  GPIOs
          1. 8.16.5.3.1 GPIO Input Transition Time Parameters
        4. 8.16.5.4  I2C
        5. 8.16.5.5  IEEE 1149.1 JTAG
        6. 8.16.5.6  ADC
        7. 8.16.5.7  Camera Parallel Port
        8. 8.16.5.8  UART
        9. 8.16.5.9  External Flash Interface
        10. 8.16.5.10 SD Host
        11. 8.16.5.11 Timers
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Functional Block Diagram
    3. 9.3  Arm Cortex-M4 Processor Core Subsystem
    4. 9.4  Wi-Fi Network Processor Subsystem
      1. 9.4.1 WLAN
      2. 9.4.2 Network Stack
    5. 9.5  Security
    6. 9.6  FIPS 140-2 Level 1 Certification
    7. 9.7  Power-Management Subsystem
      1. 9.7.1 VBAT Wide-Voltage Connection
    8. 9.8  Low-Power Operating Mode
    9. 9.9  Memory
      1. 9.9.1 Internal Memory
        1. 9.9.1.1 SRAM
        2. 9.9.1.2 ROM
        3. 9.9.1.3 Flash Memory
        4. 9.9.1.4 Memory Map
    10. 9.10 Restoring Factory Default Configuration
    11. 9.11 Boot Modes
      1. 9.11.1 Boot Mode List
    12. 9.12 Hostless Mode
    13. 9.13 Device Certification and Qualification
      1. 9.13.1 FCC Certification and Statement
      2. 9.13.2 IC/ISED Certification and Statement
      3. 9.13.3 ETSI/CE Certification
      4. 9.13.4 MIC Certification
    14. 9.14 Module Markings
    15. 9.15 End Product Labeling
    16. 9.16 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Typical Application
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection (CC3235MODx only)
      3. 10.1.3 Typical Application Schematic (CC3235MODx)
      4. 10.1.4 Typical Application Schematic (CC3235MODAx)
    2. 10.2 Device Connection and Layout Fundamentals
      1. 10.2.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.2.2 Reset
      3. 10.2.3 Unused Pins
    3. 10.3 PCB Layout Guidelines
      1. 10.3.1 General Layout Recommendations
      2. 10.3.2 CC3235MODx RF Layout Recommendations
        1. 10.3.2.1 Antenna Placement and Routing
        2. 10.3.2.2 Transmission Line Considerations
      3. 10.3.3 CC3235MODAx RF Layout Recommendations
  11. 11Environmental Requirements and SMT Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Development Tools and Software
    2. 12.2 Firmware Updates
    3. 12.3 Device Nomenclature
    4. 12.4 Documentation Support
    5. 12.5 Related Links
    6. 12.6 Support Resources
    7. 12.7 Trademarks
    8. 12.8 Electrostatic Discharge Caution
    9. 12.9 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
      3. 13.2.3 CC3235MODx Tape Specifications
      4. 13.2.4 CC3235MODAx Tape Specifications

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOB|63
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.16.5.10 SD Host

The CC3235MODx and CC3235MODAx MCU provides an interface between a local host (LH), such as an MCU and an SD memory card, and handles SD transactions with minimal LH intervention.

The SD host does the following:

  • Provides SD card access in 1-bit mode
  • Deals with SD protocol at the transmission level
  • Handles data packing
  • Adds cyclic redundancy checks (CRC)
  • Start and end bit
  • Checks for syntactical correctness

The application interface sends every SD command and either polls for the status of the adapter or waits for an interrupt request. The result is then sent back to the application interface in case of exceptions or to warn of end-of-operation. The controller can be configured to generate DMA requests and work with minimum CPU intervention. Given the nature of integration of this peripheral on the CC3235x platform, TI recommends that developers use peripheral library APIs to control and operate the block. This section emphasizes understanding the SD host APIs provided in the peripheral library of the CC3235x Software Development Kit (SDK).

The SD host features are as follows:

  • Full compliance with SD command and response sets, as defined in the SD memory card
    • Specifications, v2.0
    • Includes high-capacity (size >2 GB) cards HC SD
  • Flexible architecture, allowing support for new command structure.
  • 1-bit transfer mode specifications for SD cards
  • Built-in 1024-byte buffer for read or write
    • 512-byte buffer for both transmit and receive
    • Each buffer is 32-bits wide by 128-words deep
  • 32-bit-wide access bus to maximize bus throughput
  • Single interrupt line for multiple interrupt source events
  • Two slave DMA channels (1 for TX, 1 for RX)
  • Programmable clock generation
  • Integrates an internal transceiver that allows a direct connection to the SD card without external transceiver
  • Supports configurable busy and response timeout
  • Support for a wide range of card clock frequency with odd and even clock ratio
  • Maximum frequency supported is 24 MHz