SCHS248C November   1998  – April 2025 CD54AC257 , CD54ACT257 , CD74AC257 , CD74ACT257 , CD74ACT258

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics
    5. 4.5 Switching Specifications
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • PW|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.3 Thermal Information

THERMAL METRIC(1) D (SOIC) PW (TSSOP) BQB (WQFN) UNIT
16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 119.9(2) 139.5 98.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance — 74.8 94.6 °C/W
RθJB Junction-to-board thermal resistance — 97.7 67.7 °C/W
ΨJT Junction-to-top characterization parameter — 17.8 15.6 °C/W
ΨJB Junction-to-board characterization parameter — 96.6 67.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — 45.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application note.
(2) θJA is measured with the component mounted on an evaluation PC board in free air.