SCHS248C November   1998  – April 2025 CD54AC257 , CD54ACT257 , CD74AC257 , CD74ACT257 , CD74ACT258

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics
    5. 4.5 Switching Specifications
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Pin Configuration and Functions

CD54AC257 CD74AC257 CD54ACT257 CD74ACT257 CD74ACT258 CD54AC257, CD54ACT257 J Package; CD74AC257, CD74ACT257, CD74ACT258 D, N, or PW Package; 16-Pin SOIC PDIP, or TSSOP (Top View)Figure 3-1 CD54AC257, CD54ACT257 J Package; CD74AC257, CD74ACT257, CD74ACT258 D, N, or PW Package; 16-Pin SOIC PDIP, or TSSOP (Top View)


CD54AC257 CD74AC257 CD54ACT257 CD74ACT257 CD74ACT258 CD74AC257, CD74ACT257, CD74ACT258 BQB Package, 16-Pin WQFN (Top View)
Figure 3-2 CD74AC257, CD74ACT257, CD74ACT258 BQB Package, 16-Pin WQFN (Top View)

Table 3-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
S 1 I Select
1I0 2 I Channel 1 Input 0
1I1 3 I Channel 1 Input 1
1Y 4 O Channel 1 Output
2I0 5 I Channel 2 Input 0
2I1 6 I Channel 2 Input 1
2Y 7 O Channel 2 Output
GND 8 G Ground
3Y 9 O Channel 3 Output
3I1 10 I Channel 3 Input 1
3I0 11 I Channel 3 Input 0
4Y 12 O Channel 4 Output
4I1 13 I Channel 4 Input 1
4I0 14 I Channel 4 Input 0
OE 15 I Output Enable
VCC 16 P Positive Supply
Thermal Pad(2) – The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
(2) BQB Package only