SCHS279E December 1998 – August 2022 CD54HC4511 , CD74HC4511 , CD74HCT4511
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | D (SOIC) | N (PDIP) | PW (TSSOP) | UNIT | |
---|---|---|---|---|---|
16 PINS | 16 PINS | 16 PINS | |||
RθJA | Package thermal impedance | 67 | 73 | 108 | °C/W |