SNAS935B March   2025  – November 2025 CDC6C-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Environmental Compliance
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Device Output Configurations
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Bulk Acoustic Wave (BAW)
      2. 8.3.2  Device Block-Level Description
      3. 8.3.3  Function Pin
      4. 8.3.4  Clock Output Interfacing and Termination
      5. 8.3.5  CDC6Cx-Q1 CISPR25 Radiated Emission Performance
        1. 8.3.5.1 EMI Reduction and Slow Mode Options
      6. 8.3.6  Temperature Stability
      7. 8.3.7  Frequency Aging
      8. 8.3.8  Mechanical Robustness
      9. 8.3.9  Wettable Flanks
      10. 8.3.10 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Driving Multiple Loads With a Single CDC6Cx-Q1
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Providing Thermal Reliability
        2. 9.4.1.2 Recommended Solder Reflow Profile
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Orderable Part Number Decoder

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.