SCAS862G November   2008  – July 2016 CDCE62005

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Timing Requirements
    6. 6.6 SPI Bus Timing Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
      1. 8.2.1 Interface and Control Block
      2. 8.2.2 Input Block
      3. 8.2.3 Output Block
      4. 8.2.4 Clock Divider Module 0-4
      5. 8.2.5 Synthesizer Block
      6. 8.2.6 Computing The Output Frequency
    3. 8.3 Feature Description
      1. 8.3.1  Phase Noise Analysis
      2. 8.3.2  Output To Output Isolation
      3. 8.3.3  Device Control
      4. 8.3.4  External Control Pins
      5. 8.3.5  Input Block
        1. 8.3.5.1  Universal Input Buffers (UIB)
        2. 8.3.5.2  LVDS Fail Safe Mode
        3. 8.3.5.3  Smart Multiplexer Controls
        4. 8.3.5.4  Smart Multiplexer Auto Mode
        5. 8.3.5.5  Smart Multiplexer Dividers
        6. 8.3.5.6  Output Block
        7. 8.3.5.7  Output Multiplexer Control
        8. 8.3.5.8  Output Buffer Control
        9. 8.3.5.9  Output Buffer Control - LVCMOS Configurations
        10. 8.3.5.10 Output Dividers
        11. 8.3.5.11 Digital Phase Adjust
        12. 8.3.5.12 Phase Adjust Example
        13. 8.3.5.13 Valid Register Settings for Digital Phase Adjust Blocks
        14. 8.3.5.14 Output Synchronization
        15. 8.3.5.15 Auxiliary Output
        16. 8.3.5.16 Synthesizer Block
        17. 8.3.5.17 Input Divider
        18. 8.3.5.18 Feedback and Feedback Bypass Divider
          1. 8.3.5.18.1 VCO Select
          2. 8.3.5.18.2 Prescaler
          3. 8.3.5.18.3 Charge Pump Current Settings
          4. 8.3.5.18.4 Loop Filter
        19. 8.3.5.19 Internal Loop Filter Component Configuration
        20. 8.3.5.20 External Loop Filter Component Configuration
      6. 8.3.6  Digital Lock Detect
      7. 8.3.7  Crystal Input Interference
      8. 8.3.8  VCO Calibration
      9. 8.3.9  Startup Time Estimation
      10. 8.3.10 Analog Lock Detect
    4. 8.4 Device Functional Modes
      1. 8.4.1 Fan-Out Buffer
      2. 8.4.2 Clock Generator
      3. 8.4.3 Jitter Cleaner - Mixed Mode
        1. 8.4.3.1 Clocking ADCs with the CDCE62005
        2. 8.4.3.2 CDCE62005 SERDES Startup Mode
    5. 8.5 Programming
      1. 8.5.1 Interface and Control Block
        1. 8.5.1.1 Serial Peripheral Interface (SPI)
        2. 8.5.1.2 CDCE62005 SPI Command Structure
        3. 8.5.1.3 SPI Interface Master
        4. 8.5.1.4 SPI Consecutive Read/Write Cycles to the CDCE62005
        5. 8.5.1.5 Writing to the CDCE62005
        6. 8.5.1.6 Reading from the CDCE62005
        7. 8.5.1.7 Writing to EEPROM
      2. 8.5.2 Device Configuration
    6. 8.6 Register Maps
      1. 8.6.1 Device Registers: Register 0 Address 0x00
      2. 8.6.2 Device Registers: Register 1 Address 0x01
      3. 8.6.3 Device Registers: Register 2 Address 0x02
      4. 8.6.4 Device Registers: Register 3 Address 0x03
      5. 8.6.5 Device Registers: Register 4 Address 0x04
      6. 8.6.6 Device Registers: Register 5 Address 0x05
      7. 8.6.7 Device Registers: Register 6 Address 0x06
      8. 8.6.8 Device Registers: Register 7 Address 0x07
      9. 8.6.9 Device Registers: Register 8 Address 0x08
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Frequency Synthesizer
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Documentation Support
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.