SNAS682 March   2016 CDCM6208V2G

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematics
  5. 5 Revision History
  6. 6 Description (continued)
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information, Airflow = 0 LFM
    5. 8.5  Thermal Information, Airflow = 150 LFM
    6. 8.6  Thermal Information, Airflow = 250 LFM
    7. 8.7  Thermal Information, Airflow = 500 LFM
    8. 8.8  Single Ended Input Characteristics
    9. 8.9  Single Ended Input Characteristics (PRI_REF, SEC_REF)
    10. 8.10 Differential Input Characteristics (PRI_REF, SEC_REF)
    11. 8.11 Crystal Input Characteristics (SEC_REF)
    12. 8.12 Single Ended Output Characteristics (STATUS1, STATUS0, SDO, SDA)
    13. 8.13 PLL Characteristics
    14. 8.14 LVCMOS Output Characteristics
    15. 8.15 LVPECL (High-Swing CML) Output Characteristics
    16. 8.16 CML Output Characteristics
    17. 8.17 LVDS (Low-Power CML) Output Characteristics
    18. 8.18 HCSL Output Characteristics
    19. 8.19 Output Skew and Sync to Output Propagation Delay Characteristics
    20. 8.20 Device Individual Block Current Consumption
    21. 8.21 Worst Case Current Consumption
    22. 8.22 I2C TIMING
    23. 8.23 SPI Timing Requirements
    24. 8.24 Typical Characteristics
      1. 8.24.1 Fractional Output Divider Jitter Performance
      2. 8.24.2 Power Supply Ripple Rejection (PSRR) versus Ripple Frequency
  9. 9 Parameter Measurement Information
    1. 9.1 Characterization Test Setup
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
    4. 10.4 Device Functional Modes
      1. 10.4.1 Control Pins Definition
      2. 10.4.2 Loop Filter Recommendations for Pin Modes
      3. 10.4.3 Status Pins Definition
      4. 10.4.4 PLL Lock Detect
      5. 10.4.5 Interface and Control
        1. 10.4.5.1 Register File Reference Convention
        2. 10.4.5.2 SPI - Serial Peripheral Interface
          1. 10.4.5.2.1 Configuring the PLL
    5. 10.5 Programming
      1. 10.5.1 Writing to the CDCM6208V2G
      2. 10.5.2 Reading from the CDCM6208V2G
      3. 10.5.3 Block Write/Read Operation
      4. 10.5.4 I2C Serial Interface
    6. 10.6 Register Maps
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Design Requirements
        1. 11.2.1.1  Device Block-level Description
        2. 11.2.1.2  Device Configuration Control
        3. 11.2.1.3  Configuring the RESETN Pin
        4. 11.2.1.4  Preventing False Output Frequencies in SPI/I2C Mode at Startup:
        5. 11.2.1.5  Power Down
        6. 11.2.1.6  Device Power Up Timing:
        7. 11.2.1.7  Input Mux and Smart Input Mux
        8. 11.2.1.8  Universal INPUT Buffer (PRI_REF, SEC_REF)
        9. 11.2.1.9  VCO Calibration
        10. 11.2.1.10 Reference Divider (R)
        11. 11.2.1.11 Input Divider (M)
        12. 11.2.1.12 Feedback Divider (N)
        13. 11.2.1.13 Prescaler Dividers (PS_A, PS_B)
        14. 11.2.1.14 Phase Frequency Detector (PFD)
        15. 11.2.1.15 Charge Pump (CP)
        16. 11.2.1.16 Programmable Loop Filter
          1. 11.2.1.16.1 Loop Filter Component Selection
          2. 11.2.1.16.2 Device Output Signaling
          3. 11.2.1.16.3 Integer Output Divider (IO)
          4. 11.2.1.16.4 Fractional Output Divider (FOD)
          5. 11.2.1.16.5 Output Synchronization
          6. 11.2.1.16.6 Output MUX on Y4 and Y5
          7. 11.2.1.16.7 Staggered CLK Output Powerup for Power Sequencing of a DSP
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Jitter Considerations in SERDES Systems
        2. 11.2.2.2 Jitter Considerations in ADC and DAC Systems
      3. 11.2.3 Application Performance Plots
        1. 11.2.3.1 Typical Device Jitter
  12. 12Power Supply Recommendations
    1. 12.1 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
      1. 12.1.1 Fast Power-up Supply Ramp
      2. 12.1.2 Delaying VDD_Yx_Yy to Protect DSP IOs
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
      1. 13.2.1 Reference Schematic
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Community Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Superior Performance with Low Power:
    • Low Noise Synthesizer (265 fs-rms Typical Jitter) or Low Noise Jitter Cleaner (1.6 ps-rms Typical Jitter)
    • 0.5 W Typical Power Consumption
    • High Channel-to-Channel Isolation and Excellent PSRR
    • Device Performance Customizable Through Flexible 1.8 V, 2.5 V and 3.3 V Power Supplies, Allowing Mixed Output Voltages
  • Flexible Frequency Planning:
    • 4x Integer Down-divided Differential Clock Outputs Supporting LVPECL-like, CML, or LVDS-like Signaling
    • 4x Fractional or Integer Divided Differential Clock Outputs Supporting HCSL, LVDS-like Signaling, or Eight CMOS Outputs
    • Fractional Output Divider Achieve 0 ppm to < 1 ppm Frequency Error and Eliminates need for Crystal Oscillators and Other Clock Generators
    • Output frequencies up to 800 MHz
  • Two Differential Inputs, XTAL Support, Ability for Smart Switching
  • SPI, I2C™, and Pin Programmable
  • Professional user GUI for Quick Design Turnaround
  • 7 x 7 mm 48-QFN package (RGZ)
  • -40 °C to 85 °C temperature range

2 Applications

  • Base Band Clocking (Wireless Infrastructure)
  • Networking and Data Communications
  • Keystone C66x Multicore DSP Clocking
  • Storage Server, Portable Test Equipment,
  • Medical Imaging, High End A/V

3 Description

The CDCM6208V2G is a highly versatile, low jitter, low-power frequency synthesizer that can generate eight low jitter clock outputs, selectable between LVPECL-like high-swing CML, normal-swing CML, LVDS-like low-power CML, HCSL, or LVCMOS, from one of two inputs that can feature a low frequency crystal or CML, LVPECL, LVDS, or LVCMOS signals for a variety of wireless infrastructure baseband, wireline data communication, computing, low power medical imaging and portable test and measurement applications. The CDCM6208V2G also features an innovative fractional divider architecture for four of its outputs that can generate any frequency with better than 1ppm frequency accuracy. The CDCM6208V2G can be easily configured through I2C or SPI programming interface and in the absence of serial interface, pin mode is also available that can set the device in 1 of 32 distinct pre-programmed configurations using control pins.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
CDCM6208V2G VQFN (48) 7.00 mm × 7.00 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

4 Simplified Schematics

CDCM6208V2G Gen_Des_SCAS931.gif
CDCM6208V2G synthesizer_mode_SCAS931.gif