SLPS262C February   2010  – December 2019 CSD17308Q3

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Top View
      1.      Device Images
        1.       RDS(on) vs VGS
        2.       Gate Charge
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Support Resources
    2. 6.2 Trademarks
    3. 6.3 Electrostatic Discharge Caution
    4. 6.4 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q3 Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q3 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Q3 Tape and Reel Information

CSD17308Q3 m0144-01_lps202.gif

Notes:

  1. 10 sprocket hole pitch cumulative tolerance ±0.2
  2. Camber not to exceed 1 mm in 100 mm, noncumulative over 250 mm
  3. Material: black static dissipative polystyrene
  4. All dimensions are in mm (unless otherwise specified).
  5. Thickness: 0.30 ±0.05 mm
  6. MSL1 260°C (IR and Convection) PbF-Reflow Compatible