SLPS562C April   2016  – February 2022 CSD17382F4

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Support Resources
    2. 6.2 Receiving Notification of Documentation Updates
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern
    4. 7.4 CSD17382F4 Embossed Carrier Tape Dimensions

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YJC|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (October 2021) to Revision C (February 2022)

  • Changed ultra-low profile bullet from 0.35 mm to 0.36 mm in height.Go
  • Updated ultra-low profile image height from 0.35 mm to 0.36 mm.Go
  • Changed ultra-low profile image height from 0.35 mm to 0.36 mm.Go
  • Added FemtoFET Surface Mount Guide note.Go

Changes from Revision A (December 2016) to Revision B (October 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo

Changes from Revision * (April 2016) to Revision A (December 2016)

  • Changed the TEST CONDITIONS for gfsTransconductance From: VDS = 15 V To: VDS = 3 V in the Section 5.1 section. Go
  • Added Section 6.2 in the Section 6 section. Go
  • Updated all mechanical drawings. Go