SLPS459C January   2014  – February 2025 CSD25310Q2

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Information
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 Third-Party Products Disclaimer
    2. 5.2 Documentation Support
      1. 5.2.1 Related Documentation
    3. 5.3 Receiving Notification of Documentation Updates
    4. 5.4 Support Resources
    5. 5.5 Trademarks
    6. 5.6 Electrostatic Discharge Caution
    7. 5.7 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.2 Thermal Information

(TA = 25°C unless otherwise stated)
THERMAL METRIC MIN TYP MAX UNIT
RθJC Thermal Resistance Junction to Case(1) 4.5 °C/W
RθJA Thermal Resistance Junction to Ambient(1)(2) 55
(1) RθJC is determined with the device mounted on a 1 inch2 (6.45cm2), 2oz. (0.071mm thick) Cu pad on a 1.5 inch × 1.5 inch (3.81cm × 3.81cm), 0.06 inch (1.52mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1 inch2 (6.45cm2), 2oz. (0.071mm thick) Cu.

CSD25310Q2
Max RθJA = 55 when mounted on 1 inch2 (6.45cm2) of 2oz. (0.071mm thick) Cu.
CSD25310Q2
Max RθJA = 215 when mounted on minimum pad area of 2oz. (0.071mm thick) Cu.