SLPS759
January 2023
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Device and Documentation Support
5.1
Documentation Support
5.1.1
Related Documentation
5.2
Receiving Notification of Documentation Updates
5.3
Support Resources
5.4
Trademarks
5.5
Electrostatic Discharge Caution
5.6
Glossary
6
Mechanical, Packaging, and Orderable Information
6.1
Package Option Addendum
6.2
Tape and Reel Information
6.3
Mechanical Drawing
6.4
Recommended PCB Land Pattern
6.5
Recommended Stencil Opening
6.6
Alternate Industry Standard Compatible PCB Land Pattern
6.7
Alternate Industry Standard Compatible Stencil Opening
Package Options
Mechanical Data (Package|Pins)
RRB|41
Thermal pad, mechanical data (Package|Pins)
6.3
Mechanical Drawing
All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
This drawing is subject to change without notice.
The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical performance.