SLPS759
January 2023
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Device and Documentation Support
5.1
Documentation Support
5.1.1
Related Documentation
5.2
Receiving Notification of Documentation Updates
5.3
Support Resources
5.4
Trademarks
5.5
Electrostatic Discharge Caution
5.6
Glossary
6
Mechanical, Packaging, and Orderable Information
6.1
Package Option Addendum
6.2
Tape and Reel Information
6.3
Mechanical Drawing
6.4
Recommended PCB Land Pattern
6.5
Recommended Stencil Opening
6.6
Alternate Industry Standard Compatible PCB Land Pattern
6.7
Alternate Industry Standard Compatible Stencil Opening
Package Options
Mechanical Data (Package|Pins)
RRB|41
Thermal pad, mechanical data (Package|Pins)
2
Applications
Multiphase synchronous buck converters
Greater than 500-A
High-frequency
Memory and graphic cards
Data center and network switches
Campus and branch switches
Core and edge routers
Hardware accelerator cards
High-performance CPU/ASIC/FPGA power