SLPS669A March   2017  – January 2018 CSD95490Q5MC

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Typical Power Stage Efficiency and Power Loss
  4. 4Revision History
  5. 5Pin Configuration and Functions
    1.     Pin Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
  7. 7Application Schematic
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Community Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Mechanical Drawing
    2. 9.2 Recommended PCB Land Pattern
    3. 9.3 Recommended Stencil Opening

Package Options

Mechanical Data (Package|Pins)
  • DMC|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

TA = 25°C (unless otherwise stated)(1)
MINMAXUNIT
VIN to PGND –0.3 20 V
VIN to VSW –0.3 20 V
VIN to VSW (10 ns) 23 V
VSW to PGND –0.3 20 V
VSW to PGND (10 ns) –7 23 V
VDD to PGND –0.3 7 V
EN/FCCM, TAO/FLT, LSET to PGND(2) –0.3 VDD + 0.3 V
IOUT, VOS, PWM to PGND –0.3 7 V
REFIN –0.3 3.6 V
BOOT to BOOTR(2) –0.3 VDD + 0.3 V
BOOT to PGND –0.3 30 V
TJ Operating junction temperature –55 150 °C
Tstg Storage temperature –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Should not exceed 7 V.