SNAS265J June   2005  – September 2015 DAC121S101 , DAC121S101-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description continued
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 AC and Timing Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Section
      2. 8.3.2 Resistor String
      3. 8.3.3 Output Amplifier
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
      2. 8.4.2 Power-Down Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
      2. 8.5.2 Input Shift Register
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DSP and Microprocessor Interfacing
        1. 9.1.1.1 ADSP-2101/ADSP2103 Interfacing
          1. 9.1.1.1.1 80C51/80L51 Interface
          2. 9.1.1.1.2 68HC11 Interface
          3. 9.1.1.1.3 Microwire Interface
      2. 9.1.2 Bipolar Operation
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Using References as Power Supplies
      1. 10.1.1 LM4130
      2. 10.1.2 LM4050
      3. 10.1.3 LP3985
      4. 10.1.4 LP2980
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Specification Definitions
    2. 12.2 Related Links
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

A precision analog component requires careful layout, adequate bypassing, and clean, well-regulated power supplies. The power applied to VA must be well regulated and low noise. Switching power supplies and DC/DC converters will often have high-frequency glitches or spikes riding on the output voltage. In addition, digital components can create similar high-frequency spikes as their internal logic switches states. This noise can easily couple into the DAC output voltage through various paths between the power connections and analog output. As with the GND connection, VA must be connected to a power supply plane or trace that is separate from the connection for digital logic until they are connected at the power entry point.

The DAC121S101 power supply must be bypassed with a 10-µF and a 0.1-µF capacitor as close as possible to the device with the 0.1 µF right at the device supply pin. The 10-µF capacitor must be a tantalum type and the 0.1-µF capacitor must be a low ESL, low ESR type. The power supply for the DAC121S101 must only be used for analog circuits.

For best accuracy and minimum noise, the printed-circuit-board containing the DAC121S101 must have separate analog and digital areas. The areas are defined by the locations of the analog and digital power planes. Both of these planes must be located in the same board layer. There must be a single ground plane. A single ground plane is preferred if digital return current does not flow through the analog ground area. Frequently a single ground plane design will use a fencing technique to prevent the mixing of analog and digital ground current. Separate ground planes must only be used when the fencing technique is inadequate. The separate ground planes must be connected in one place, preferably near the DAC121S101. Take special care to ensure that digital signals with fast edge rates do not pass over split ground planes. They must always have a continuous return path below their traces.

Avoid crossover of analog and digital signals and keep the clock and data lines on the component side of the board. The clock and data lines must have controlled impedances.

11.2 Layout Example

DAC121S101 DAC121S101-Q1 new_layout.gif Figure 46. Typical Layout