SLASES7A July   2019  – December 2019 DAC43401 , DAC53401

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
      2.      Power-Supply Control With the DACx3401
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: I2CTM Standard mode
    7. 7.7  Timing Requirements: I2CTM Fast mode
    8. 7.8  Timing Requirements: I2CTM Fast+ mode
    9. 7.9  Typical Characteristics: VDD = 1.8 V (Reference = VDD) or VDD = 2 V (Internal Reference)
    10. 7.10 Typical Characteristics: VDD = 5.5 V (Reference = VDD) or VDD = 5 V (Internal Reference)
    11. 7.11 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 8.3.1.1 Reference Selection and DAC Transfer Function
          1. 8.3.1.1.1 Power Supply as Reference
          2. 8.3.1.1.2 Internal Reference
      2. 8.3.2 DAC Update
        1. 8.3.2.1 DAC Update Busy
      3. 8.3.3 Nonvolatile Memory (EEPROM or NVM)
        1. 8.3.3.1 NVM Cyclic Redundancy Check
        2. 8.3.3.2 NVM_CRC_ALARM_USER Bit
        3. 8.3.3.3 NVM_CRC_ALARM_INTERNAL Bit
      4. 8.3.4 Programmable Slew Rate
      5. 8.3.5 Power-on-Reset (POR)
      6. 8.3.6 Software Reset
      7. 8.3.7 Device Lock Feature
      8. 8.3.8 PMBus Compatibility
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Down Mode
      2. 8.4.2 Continuous Waveform Generation (CWG) Mode
      3. 8.4.3 PMBus Compatibility Mode
      4. 8.4.4 Medical Alarm Generation Mode
        1. 8.4.4.1 Low-Priority Alarm
        2. 8.4.4.2 Medium-Priority Alarm
        3. 8.4.4.3 High-Priority Alarm
        4. 8.4.4.4 Interburst Time
        5. 8.4.4.5 Pulse Off Time
        6. 8.4.4.6 Pulse On Time
    5. 8.5 Programming
      1. 8.5.1 F/S Mode Protocol
      2. 8.5.2 DACx3401 I2C Update Sequence
      3. 8.5.3 Address Byte
      4. 8.5.4 Command Byte
      5. 8.5.5 I2C Read Sequence
    6. 8.6 Register Map
      1. 8.6.1  STATUS Register (address = D0h) (reset = 000Ch or 0014h)
        1. Table 18. STATUS Register Field Descriptions
      2. 8.6.2  GENERAL_CONFIG Register (address = D1h) (reset = 01F0h)
        1. Table 19. GENERAL_CONFIG Register Field Descriptions
      3. 8.6.3  MED_ALARM_CONFIG Register (address = D2h) (reset = 0000h)
        1. Table 20. MED_ALARM_CONFIG Register Field Descriptions
      4. 8.6.4  TRIGGER Register (address = D3h) (reset = 0008h)
        1. Table 21. TRIGGER Register Field Descriptions
      5. 8.6.5  DAC_DATA Register (address = 21h) (reset = 0000h)
        1. Table 22. DAC_DATA Register Field Descriptions
      6. 8.6.6  DAC_MARGIN_HIGH Register (address = 25h) (reset = 0000h)
        1. Table 23. DAC_MARGIN_HIGH Register Field Descriptions
      7. 8.6.7  DAC_MARGIN_LOW Register (address = 26h) (reset = 0000h)
        1. Table 24. DAC_MARGIN_LOW Register Field Descriptions
      8. 8.6.8  PMBUS_OPERATION Register (address = 01h) (reset = 0000h)
        1. Table 25. PMBUS_OPERATION Register Field Descriptions
      9. 8.6.9  PMBUS_STATUS_BYTE Register (address = 78h) (reset = 0000h)
        1. Table 26. PMBUS_STATUS_BYTE Register Field Descriptions
      10. 8.6.10 PMBUS_VERSION Register (address = 98h) (reset = 2200h)
        1. Table 27. PMBUS_VERSION Register Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Programmable LED Biasing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Power-Supply Margining
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Medical Alarm Generation
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5.3 Address Byte

The address byte, as shown in Table 11, is the first byte received following the start condition from the master device. The first four bits (MSBs) of the address are factory preset to 1001. The next three bits of the address are controlled by the A0 pin. The A0 pin input can be connected to VDD, AGND, SCL, or SDA. The A0 pin is sampled during the first byte of each data frame to determine the address. The device latches the value of the address pin, and consequently responds to that particular address according to Table 12.

The DACx3401 family supports broadcast addressing, which can be used for synchronously updating or powering down multiple DACx3401 devices. The DACx3401 family is designed to work with other members of the family to support multichip synchronous updates. Using the broadcast address, the DACx3401 devices respond regardless of the states of the address pins. Broadcast is supported only in write mode.

Table 11. Address Byte

COMMENT MSB LSB
— AD6 AD5 AD4 AD3 AD2 AD1 AD0 R/W
General address 1 0 0 1 See Table 12 (slave address column) 0 or 1
Broadcast address 1 0 0 0 1 1 1 0

Table 12. Address Format

SLAVE ADDRESS A0 PIN
000 AGND
001 VDD
010 SDA
011 SCL