SLAS464C December   2006  – January 2018 DAC8560

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Functional Block Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements
    7. 6.7  Typical Characteristics: Internal Reference
    8. 6.8  Typical Characteristics: DAC at VDD = 5 V
    9. 6.9  Typical Characteristics: DAC at VDD = 3.6 V
    10. 6.10 Typical Characteristics: DAC at VDD = 2.7 V
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter (DAC)
      2. 7.3.2 Resistor String
      3. 7.3.3 Output Amplifier
      4. 7.3.4 DAC Noise Performance
      5. 7.3.5 Internal Reference
        1. 7.3.5.1 Enable/Disable Internal Reference
        2. 7.3.5.2 Internal Reference Load
          1. 7.3.5.2.1 Supply Voltage
          2. 7.3.5.2.2 Temperature Drift
          3. 7.3.5.2.3 Noise Performance
          4. 7.3.5.2.4 Load Regulation
          5. 7.3.5.2.5 Long-Term Stability
          6. 7.3.5.2.6 Thermal Hysteresis
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Input Shift Register
      3. 7.5.3 SYNC Interrupt
      4. 7.5.4 Power-On Reset
    6. 7.6 Register Maps
      1. 7.6.1 Write Sequence for Disabling the DAC8560 Internal Reference
        1. Table 1. Write Sequence for Disabling the DAC8560 Internal Reference
      2. 7.6.2 Enabling the DAC8560 Internal Reference (Write Sequence 1 of 2)
        1. Table 2. Enabling the DAC8560 Internal Reference (Write Sequence 1 of 2)
      3. 7.6.3 Enabling the DAC8560 Internal Reference (Write Sequence 2 of 2)
        1. Table 3. Enabling the DAC8560 Internal Reference (Write Sequence 2 of 2)
      4. 7.6.4 DAC8560 Data Input Register Format
        1. Table 4. DAC8560 Data Input Register Format
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure or Bipolar Operation > ±VREF
        1. 8.2.2.1 Bipolar Operation Greater Than ±VREF
          1. 8.2.2.1.1 Passive Component Selection
          2. 8.2.2.1.2 Amplifier Selection
        2. 8.2.2.2 Microprocessor Interfacing
          1. 8.2.2.2.1 DAC8560 to 8051 Interface
          2. 8.2.2.2.2 DAC8560 to Microwire Interface
          3. 8.2.2.2.3 DAC8560 to 68HC11 Interface
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resource
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Enable/Disable Internal Reference

The DAC8560 internal reference is enabled by default; however, the reference can be disabled for debugging or evaluation purposes. A serial command requiring at least two additional SCLK cycles at the end of the 24-bit write sequence (see Serial Interface) must be used to disable the internal reference. For proper operation, a total of at least 26 SCLK cycles are required for each enable/disable internal reference update sequence, during which SYNC must be held low. To disable the internal reference, execute the write sequence illustrated in Table 1 followed by at least two additional SCLK falling edges while SYNC is low.

To then enable the reference, either perform a power-cycle to reset the device, or sequentially execute the two write sequences in Table 2 and Table 3. Each of these write sequences must be followed by at least two additional SCLK falling edges while SYNC remains low.

During the time that the internal reference is disabled, the DAC will function normally using an external reference. At this point, the internal reference is disconnected from the VREF pin (tri-state). Do not attempt to drive the VREF pin externally and internally at the same time indefinitely.