SLASFL3 September   2026 DAC90802

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
      1. 5.8.1 Typical Characteristics: Linearity
      2. 5.8.2 Typical Characteristics: Glitch
      3. 5.8.3 Typical Characteristics: Multiplying Mode
      4. 5.8.4 Typical Characteristics: Fast-Settling Mode
      5. 5.8.5 Typical Characteristics: AWG Mode
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Digital-to-Analog Converters
        1. 6.3.1.1 Reference
        2. 6.3.1.2 Output Span
          1. 6.3.1.2.1 Gain Overrange
        3. 6.3.1.3 Output Synchronization
        4. 6.3.1.4 Thermal Sensors
      2. 6.3.2 Power-On
      3. 6.3.3 Serial Data Interface
        1. 6.3.3.1 SPI Configurations
        2. 6.3.3.2 SPI Stream Mode
        3. 6.3.3.3 SPI Daisy Chain Mode
    4. 6.4 Device Functional Modes
      1. 6.4.1 AWG Mode
      2. 6.4.2 Fast Settling Mode
      3. 6.4.3 Multiplying Mode
  8. 7 Register Maps
    1. 7.1 COMMON Registers
    2. 7.2 HS_DATA Registers
    3. 7.3 HR_DATA Registers
  9. 8 Application and Implementation
    1. 8.1 Application
    2. 8.2 Design Requirements
      1. 8.2.1 Reference Signal Chain Information
        1. 8.2.1.1 DC Reference
        2. 8.2.1.2 AC Reference
      2. 8.2.2 Optimising the Self-Heating Trim to Achieve Lowest THD Across Frequencies for High Voltage Swing
      3. 8.2.3 Digital Interface
      4. 8.2.4 Grounding Recommendations
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Recommendation
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.4 Grounding Recommendations

To achieve the best performance from the DAC90802, careful grounding and decoupling are essential. Using a PCB with a ground-plane reference helps confine digital return currents effectively. By creating a low mutual inductance path directly beneath high-frequency digital traces, return currents follow the signal paths, which minimizes crosstalk. In precision applications, managing the ground plane is critical to limiting common-impedance coupling, as dc signals tend to spread across the plane rather than staying confined under specific traces.

Effective isolation between REFGND and AGND is also necessary to prevent common-mode current flow between the grounds. While these grounds must remain isolated from current flow, maintain the same DC potential across grounds. The most reliable method for achieving this is through a single-point connection located near the reference device as Figure 8-7 shows.

DAC90802 DAC90802 Grounding Recommendation Figure 8-7 DAC90802 Grounding Recommendation