DLPS138C July   2018  – May 2022 DLP230KP

PRODUCTION DATA  

  1. Features
  2. Display Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics (1)
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Low-Speed Interface
      3. 7.3.3 High-Speed Interface
      4. 7.3.4 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Device Markings
    2. 11.2 Chipset Resources
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

Micromirror Array Physical Characteristics

PARAMETERVALUEUNIT
Number of active columns(1)See Figure 6-15960micromirrors
Number of active rows(1)See Figure 6-15540micromirrors
εMicromirror (pixel) pitchSee Figure 6-165.4µm
Micromirror active array widthMicromirror pitch × number of active columns; see Figure 6-155.184mm
Micromirror active array heightMicromirror pitch × number of active rows; see Figure 6-152.916mm
Micromirror active borderPond of micromirror (POM)(2)20micromirrors/side
The fast switching speed of the DMD micromirrors combined with advanced DLP image processing algorithms enables each micromirror to display two distinct pixels on the screen during every frame, resulting in a full 1280 × 720 pixel image being displayed.
The structure and qualities of the border around the active array include a band of partially functional micromirrors called the POM. These micromirrors are structurally or electrically prevented from tilting toward the bright or ON state, but require an electrical bias to tilt toward OFF.
GUID-5D62B46F-18AF-469B-A303-3CFA0953C212-low.gif Figure 6-15 Micromirror Array Physical Characteristics
GUID-A6D235F3-4CFD-4C2F-B50B-8494A8C939CE-low.gifFigure 6-16 Mirror (Pixel) Pitch