4 Revision History
Changes from A Revision (March 2018) to B Revision
- Added illumination overfill maximum allowable heat load specifications, table notes, and figure in Recommended Operating ConditionsGo
- Added calculation for array width and height with respect to number of active columns and rows in the Physical Characteristics of the Micromirror Array tableGo
- Deleted axis-of-rotation specification from Optical Characteristics of the Micromirror Array table, as it was deemed unnecessary for customer designsGo
- Deleted illumination overfill row and corresponding table note in the Window Characteristics tableGo
- Changed description of illumination overfill in the Illumination Overfill and Alignment section and added reference to Recommended Operating Conditions overfill specificationGo
- Added the Device Handling sectionGo
Changes from * Revision (November 2017) to A Revision
- Changed the device status from Advance Information to Production DataGo
- Changed package designator from CPGA to FYJGo
- Added comment to ground VCCH and VSSH pins Go
- Changed maximum DMD storage temperature from 105°C to 125°C in Storage Conditions tableGo
- Changed IOFFSET from 2.16 mA to 2.93 mA in Electrical Characteristics tableGo
- Changed IRESET from 1.5 mA to -2.00 mA in Electrical Characteristics tableGo
- Changed POFFSET from 13.2 mW to 25.64 mW in Electrical Characteristics tableGo
- Changed PBIAS from 37.3 mW to 37.95 mW in Electrical Characteristics tableGo
- Changed PRESET from 15.8 mW to 21.00 mW in Electrical Characteristics tableGo
- Changed PTOTAL from 236.6 mW to 254.77 mW in Electrical Characteristics table Go
- Added table note in Optical Parameters tableGo
- Changed device marking number in Device Markings sectionGo