DLPS036B September 2014 – October 2016 DLP9000
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Achieving optimal DMD performance requires proper management of the maximum DMD case temperature, the maximum temperature of any individual micromirror in the active array and the temperature gradient between any two points on or within the package.
The DMD is designed to conduct the absorbed and dissipated heat back to the series FLS package where it can be removed by an appropriate thermal management system. The thermal management system must be capable of maintaining the package within the specified operational temperatures at the thermal test point locations (refer to Figure 15 or Micromirror Array Temperature Calculation). The total heat load on the DMD is typically driven by the incident light absorbed by the active area; although other contributions can include light energy absorbed by the window aperture, electrical power dissipation of the array, and parasitic heating. For the thermal resistance, refer to Thermal Information.