DLPS271 April   2024 DLPC7530

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Electrical Characteristics
    6. 5.6  Pin Electrical Characteristics
    7. 5.7  DMD HSSI Electrical Characteristics
    8. 5.8  DMD Low-Speed LVDS Electrical Characteristics
    9. 5.9  V-by-One Interface Electrical Characteristics
    10. 5.10 FPD-Link LVDS Electrical Characteristics
    11. 5.11 USB Electrical Characteristics
    12. 5.12 System Oscillator Timing Requirements
    13. 5.13 Power Supply and Reset Timing Requirements
    14. 5.14 DMD HSSI Timing Requirements
    15. 5.15 DMD Low-Speed LVDS Timing Requirements
    16. 5.16 V-by-One Interface General Timing Requirements
    17. 5.17 FPD-Link Interface General Timing Requirements
    18. 5.18 Parallel Interface General Timing Requirements
    19. 5.19 Source Frame Timing Requirements
    20. 5.20 Synchronous Serial Port Interface Timing Requirements
    21. 5.21 Controller and Target I2C Interface Timing Requirements
    22. 5.22 Programmable Output Clock Timing Requirements
    23. 5.23 JTAG Boundary Scan Interface Timing Requirements (Debug Only)
    24. 5.24 JTAG ARM Multi-Ice Interface Timing Requirements (Debug Only)
    25. 5.25 Multi-Trace ETM Interface Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Sources
      2. 6.3.2 Processing Delays
      3. 6.3.3 Parallel Interface
      4. 6.3.4 FPD-Link Interface
      5. 6.3.5 V-by-One Interface
      6. 6.3.6 DMD (HSSI) Interface
      7. 6.3.7 Program Memory Flash Interface
      8. 6.3.8 GPIO Supported Functionality
      9. 6.3.9 Debug Support
    4. 6.4 Device Operational Modes
      1. 6.4.1 Standby Mode
      2. 6.4.2 Active Mode
        1. 6.4.2.1 Normal Configuration
        2. 6.4.2.2 Low Latency Configuration
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
  9. 8 Power Supply Recommendations
    1. 8.1 Power Supply Management
    2. 8.2 Hot Plug Usage
    3. 8.3 Power Supplies for Unused Input Source Interfaces
    4. 8.4 Power Supplies
      1. 8.4.1 1.15-V Power Supplies
      2. 8.4.2 1.21V Power Supply
      3. 8.4.3 1.8-V Power Supplies
      4. 8.4.4 3.3-V Power Supplies
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1  General Layout Guidelines
      2. 9.1.2  Power Supply Layout Guidelines
      3. 9.1.3  Layout Guidelines for Internal Controller PLL Power
      4. 9.1.4  Layout Guideline for DLPC7530 Reference Clock
        1. 9.1.4.1 Recommended Crystal Oscillator Configuration
      5. 9.1.5  V-by-One Interface Layout Considerations
      6. 9.1.6  FPD-Link Interface Layout Considerations
      7. 9.1.7  USB Interface Layout Considerations
      8. 9.1.8  DMD Interface Layout Considerations
      9. 9.1.9  General Handling Guidelines for Unused CMOS-Type Pins
      10. 9.1.10 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
    2. 9.2 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Device Nomenclature
        1. 10.1.2.1 Device Markings
        2. 10.1.2.2 Package Data
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
      1. 10.6.1 Video Timing Parameter Definitions
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     92

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.14 DMD HSSI Timing Requirements

over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN NOM MAX UNIT
Baud Baud rate 2.4 3.2 Gbps
UI Unit interval, 1/baud 312.5 416.7 ps
tR Differential output rise time (1)(2)
(0% to 100% of minimum eye mask height)		 Data 50 115 ps
Clock 50 135 ps
tF Differential output fall time(1)(2)
(0% to 100% of minimum eye mask height)		 Data 50 115 ps
Clock 50 135 ps
tX1 Maximum eye closure(3) at zero crossing 0.15 UI
tX2 Maximum eye closure(3) at minimum eye height 0.375 UI
tEYE Differential data eye(3) 0.7 UI
tskln2ln Lane to lane skew within a macro(2) |200| ps
tskM2M Lane to lane skew macro to macro(2) |4UI+200| ps
fSSCD Spread Spectrum (down spreading only) (4) When SSCD enabled 1 %
fMOD Modulation frequency (4) When SSCD enabled 78.125 KHz
(1) Rise and fall times are associated with VDIFF-pp, as shown in Figure 5-10.
(2) Measured with an interconnect with an insertion loss of 3dB at 1.6GHz
(3) See Figure 5-11.
(4) When SSCD is enabled, the available modulation waveform is triangular.
DLPC7530 HSSI Differential Timing Parameters
VCM is removed when signals are viewed differentially.
Figure 5-10 HSSI Differential Timing Parameters
DLPC7530 HSSI Eye Characteristics Figure 5-11 HSSI Eye Characteristics