SLLSEJ7 February   2015 DP83848-HT

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Typical System Diagram
  5. Revision History
  6. Bare Die Information
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 DC Electrical Characteristics
    6. 7.6 AC Timing Specifications
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 100BASE-TX Transmitter
        1. 8.3.1.1 Code-Group Encoding and Injection
        2. 8.3.1.2 Scrambler
        3. 8.3.1.3 NRZ to NRZI Encoder
        4. 8.3.1.4 Binary to MLT-3 Convertor
      2. 8.3.2 100BASE-TX Receiver
        1. 8.3.2.1  Analog Front End
        2. 8.3.2.2  Digital Signal Processor
          1. 8.3.2.2.1 Digital Adaptive Equalization and Gain Control
          2. 8.3.2.2.2 Base Line Wander Compensation
        3. 8.3.2.3  Signal Detect
        4. 8.3.2.4  MLT-3 to NRZI Decoder
        5. 8.3.2.5  NRZI to NRZ
        6. 8.3.2.6  Serial to Parallel
        7. 8.3.2.7  Descrambler
        8. 8.3.2.8  Code-Group Alignment
        9. 8.3.2.9  4B/5B Decoder
        10. 8.3.2.10 100BASE-TX Link Integrity Monitor
        11. 8.3.2.11 Bad SSD Detection
      3. 8.3.3 10BASE-T Transceiver Module
        1. 8.3.3.1  Operational Modes
          1. 8.3.3.1.1 Half Duplex Mode
          2. 8.3.3.1.2 Full Duplex Mode
        2. 8.3.3.2  Smart Squelch
        3. 8.3.3.3  Collision Detection and SQE
        4. 8.3.3.4  Carrier Sense
        5. 8.3.3.5  Normal Link Pulse Detection/Generation
        6. 8.3.3.6  Jabber Function
        7. 8.3.3.7  Automatic Link Polarity Detection and Correction
        8. 8.3.3.8  Transmit and Receive Filtering
        9. 8.3.3.9  Transmitter
        10. 8.3.3.10 Receiver
      4. 8.3.4 Reset Operation
        1. 8.3.4.1 Hardware Reset
        2. 8.3.4.2 Software Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 MII Interface
        1. 8.4.1.1 Nibble-Wide MII Data Interface
        2. 8.4.1.2 Collision Detect
        3. 8.4.1.3 Carrier Sense
      2. 8.4.2 Reduced MII Interface
      3. 8.4.3 10 Mb Serial Network Interface (SNI)
      4. 8.4.4 802.3u MII Serial Management Interface
        1. 8.4.4.1 Serial Management Register Access
        2. 8.4.4.2 Serial Management Access Protocol
        3. 8.4.4.3 Serial Management Preamble Suppression
    5. 8.5 Programming
      1. 8.5.1 Auto-Negotiation
        1. 8.5.1.1 Auto-Negotiation Pin Control
        2. 8.5.1.2 Auto-Negotiation Register Control
        3. 8.5.1.3 Auto-Negotiation Parallel Detection
        4. 8.5.1.4 Auto-Negotiation Restart
        5. 8.5.1.5 Enabling Auto-Negotiation via Software
        6. 8.5.1.6 Auto-Negotiation Complete Time
      2. 8.5.2 Auto-MDIX
      3. 8.5.3 PHY Address
        1. 8.5.3.1 MII Isolate Mode
      4. 8.5.4 LED Interface
        1. 8.5.4.1 LEDs
        2. 8.5.4.2 LED Direct Control
      5. 8.5.5 Half Duplex vs Full Duplex
      6. 8.5.6 Internal Loopback
      7. 8.5.7 BIST
    6. 8.6 Register Maps
      1. 8.6.1 Register Block
      2. 8.6.2 Register Definition
        1. 8.6.2.1 Basic Mode Control Register (BMCR)
        2. 8.6.2.2 Basic Mode Status Register (BMSR)
        3. 8.6.2.3 PHY Identifier Register 1 (PHYIDR1)
        4. 8.6.2.4 PHY Identifier Register 2 (PHYIDR2)
        5. 8.6.2.5 Auto-Negotiation Advertisement Register (ANAR)
        6. 8.6.2.6 Auto-Negotiation Link Partner Ability Register (ANLPAR) (BASE Page)
        7. 8.6.2.7 Auto-Negotiation Link Partner Ability Register (ANLPAR) (Next Page)
        8. 8.6.2.8 Auto-Negotiate Expansion Register (ANER)
        9. 8.6.2.9 Auto-Negotiation Next Page Transmit Register (ANNPTR)
      3. 8.6.3 Extended Registers
        1. 8.6.3.1  PHY Status Register (PHYSTS)
        2. 8.6.3.2  MII Interrupt Control Register (MICR)
        3. 8.6.3.3  MII Interrupt Status and Miscellaneous Control Register (MISR)
        4. 8.6.3.4  False Carrier Sense Counter Register (FCSCR)
        5. 8.6.3.5  Receiver Error Counter Register (RECR)
        6. 8.6.3.6  100 Mb/s PCS Configuration and Status Register (PCSR)
        7. 8.6.3.7  RMII and Bypass Register (RBR)
        8. 8.6.3.8  LED Direct Control Register (LEDCR)
        9. 8.6.3.9  PHY Control Register (PHYCR)
        10. 8.6.3.10 10Base-T Status/Control Register (10BTSCR)
        11. 8.6.3.11 CD Test and BIST Extensions Register (CDCTRL1)
        12. 8.6.3.12 Energy Detect Control (EDCR)
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Clock Requirements
        2. 9.2.1.2 Magnetics
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 TPI Network Circuit
        2. 9.2.2.2 Clock In (X1) Requirements
          1. 9.2.2.2.1 Oscillator
          2. 9.2.2.2.2 Crystal
        3. 9.2.2.3 Power Feedback Circuit
        4. 9.2.2.4 Power Down and Interrupt
          1. 9.2.2.4.1 Power-Down Control Mode
          2. 9.2.2.4.2 Interrupt Mechanisms
        5. 9.2.2.5 Energy Detect Mode
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Layer Stacking
    2. 11.2 Layout Example
    3. 11.3 ESD Protection
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • KGD|0
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Bare Die Information

DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS
10.5 mils Silicon with backgrind Ground AlCu.5% 0.9 µm
die_sllsej7.gif

Bond Pin Coordinates in Microns

DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX
TX_CLK 1 70.339 1149.962 133.368 1212.499
TX_EN 2 71.466 1074.524 134.495 1137.061
TXD_0 3 74.847 997.96 137.875 1060.497
TXD_1 4 72.593 923.648 135.621 986.185
TXD_2 5 72.593 850.461 135.621 912.998
TXD_3/SNI_MODE 6 73.72 724.356 136.748 786.893
PWR_DOWN/INT 7 74.847 652.295 137.875 714.832
TCK 8 72.812 527.247 135.841 589.783
TDO 9 75.657 453.341 138.686 515.878
TMS 10 74.235 376.592 137.263 439.129
TRST 11 69.967 304.108 132.996 366.645
TDI 12 74.235 228.781 137.263 291.318
RD- 13 322.955 49.09 385.984 111.627
RD+ 14 402.74 49.09 465.768 111.627
AGND 15 476.319 48.204 539.348 110.741
AGND 16 553.445 49.09 616.473 111.627
TD- 17 625.251 51.748 688.279 114.285
TD+ 18 702.376 50.862 765.405 113.399
PFBIN1 19 776.842 50.862 839.87 113.399
AGND 20 852.194 51.748 915.223 114.285
RESERVED 21 927.068 53.532 990.096 116.069
RESERVED 22 1001.534 51.76 1064.562 114.297
AVDD33 23 1076.886 51.76 1139.914 114.297
PFBOUT 24 1155.784 51.76 1218.813 114.297
RBIAS 25 1230.25 51.76 1293.279 114.297
25MHz_OUT 26 1455.826 212.106 1518.855 274.643
LED_ACT/COL/AN_EN 27 1457.926 285.53 1520.954 348.067
LED_SPEED/AN1 28 1455.826 409.302 1518.855 471.839
LED_LINK/AN0 29 1457.291 481.851 1520.319 544.388
RESET_N 30 1457.99 557.373 1521.019 619.91
MDIO 31 1456.591 655.971 1519.619 718.508
MDC 32 1457.99 730.794 1521.019 793.331
IOVDD33 33 1458.752 830.293 1521.781 892.83
X2 34 1458.752 907.287 1521.781 969.824
X1 35 1457.18 981.924 1520.208 1044.461
IOGND 36 1457.18 1076.987 1520.208 1139.524
DGND 37 1458.769 1150.513 1521.797 1213.05
PFBIN2 38 1205.966 1405.764 1268.995 1468.301
RX_CLK 39 1127.754 1407.005 1190.782 1469.542
RX_DV/MII_MODE 40 1052.024 1405.764 1115.053 1468.301
CRS/CRS_DV/LED_CFG 41 978.157 1405.764 1041.185 1468.301
RX_ER/MDIX_EN 42 903.668 1407.625 966.697 1470.162
COL/PHYAD0 43 804.841 1407.148 867.869 1469.685
RXD_0/PHYAD1 44 727.429 1407.148 790.457 1469.685
RXD_1/PHYAD2 45 629.094 1406.451 692.123 1468.988
RXD_2/PHYAD3 46 554.472 1407.148 617.5 1469.685
RXD_3/PHYAD4 47 474.967 1407.148 537.996 1469.685
IOGND 48 399.647 1406.451 462.676 1468.988
IOVDD33 49 326.42 1406.451 389.448 1468.988