SLVSM69 November   2026 DP83C1111

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 DP83C1111x Device Comparison
  6. 5 Pin Configuration and Function
    1. 5.1 Pin Configuration and Functions (DP83C1111xM)
    2. 5.2 Pin Configuration and Functions (DP83C1111xRL)
    3. 5.3 Pin Configuration and Functions (DP83C1111xRF)
  7. 6 Specifications
    1. 6.1 Thermal Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Auto-Negotiation (Speed/Duplex Selection)
      2. 7.3.2  Auto-MDIX Resolution
      3. 7.3.3  Energy Efficient Ethernet
        1. 7.3.3.1 EEE Overview
        2. 7.3.3.2 EEE Negotiation
      4. 7.3.4  EEE for Legacy MACs Not Supporting 802.3az
      5. 7.3.5  Wake-on-LAN Packet Detection
        1. 7.3.5.1 Magic Packet Structure
        2. 7.3.5.2 Magic Packet Example
        3. 7.3.5.3 Wake-on-LAN Configuration and Status
      6. 7.3.6  Low Power Modes
        1. 7.3.6.1 Active Sleep
        2. 7.3.6.2 IEEE Power-Down
        3. 7.3.6.3 Deep Power Down State
      7. 7.3.7  Clock Output
      8. 7.3.8  Media Independent Interface (MII)
      9. 7.3.9  Reduced Media Independent Interface (RMII)
      10. 7.3.10 RMII Repeater Mode
      11. 7.3.11 Serial Management Interface
        1. 7.3.11.1 Extended Register Space Access
        2. 7.3.11.2 Write Address Operation
        3. 7.3.11.3 Read Address Operation
        4. 7.3.11.4 Write (No Post Increment) Operation
        5. 7.3.11.5 Read (No Post Increment) Operation
        6. 7.3.11.6 Example Write Operation (No Post Increment)
      12. 7.3.12 100BASE-TX
        1. 7.3.12.1 100BASE-TX Transmitter
          1. 7.3.12.1.1 Code-Group Encoding and Injection
          2. 7.3.12.1.2 Scrambler
          3. 7.3.12.1.3 NRZ to NRZI Encoder
          4. 7.3.12.1.4 Binary to MLT-3 Converter
        2. 7.3.12.2 100BASE-TX Receiver
      13. 7.3.13 10BASE-Te
        1. 7.3.13.1 Squelch
        2. 7.3.13.2 Normal Link Pulse Detection and Generation
        3. 7.3.13.3 Jabber
        4. 7.3.13.4 Active Link Polarity Detection and Correction
      14. 7.3.14 Loopback Modes
        1. 7.3.14.1 Near-end Loopback
        2. 7.3.14.2 MII Loopback
        3. 7.3.14.3 PCS Loopback
        4. 7.3.14.4 Digital Loopback
        5. 7.3.14.5 Analog Loopback
        6. 7.3.14.6 Far-End (Reverse) Loopback
      15. 7.3.15 BIST Configurations
      16. 7.3.16 Cable Diagnostics
        1. 7.3.16.1 Time Domain Reflectometry (TDR)
      17. 7.3.17 LED and GPIO Configuration
    4. 7.4 DP83C1111x Configuration
      1. 7.4.1 Hardware Bootstraps Configuration
        1. 7.4.1.1 DP83C1111x Hardware Configurations
  9. 8 DP83C1111x Registers
    1. 8.1 DP83C1111x Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Twisted-Pair Interface (TPI) Network Circuit
      2. 9.2.2 Transformer Recommendations
      3. 9.2.3 Capacitive DC Blocking
      4. 9.2.4 Design Requirements
        1. 9.2.4.1 Clock Requirements
          1. 9.2.4.1.1 Oscillator
          2. 9.2.4.1.2 Crystal
      5. 9.2.5 Detailed Design Procedure
        1. 9.2.5.1 MII Layout Guidelines
        2. 9.2.5.2 RMII Layout Guidelines
        3. 9.2.5.3 MDI Layout Guidelines
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Signal Traces
        2. 9.4.1.2 Return Path
        3. 9.4.1.3 Transformer Layout
        4. 9.4.1.4 Metal Pour
        5. 9.4.1.5 PCB Layer Stacking
          1. 9.4.1.5.1 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Thermal Information

THERMAL METRIC (1) Device UNIT
RHB (VQFN)
32 PINS
RθJA Junction-to-ambient thermal resistance 52 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 11.9 °C/W
RθJB Junction-to-board thermal resistance 31.5 °C/W
ΨJT Junction-to-top characterization parameter 2.1 °C/W
ΨJB Junction-to-board characterization parameter 31.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.