SNLS656D August   2020  – December 2023 DP83TD510E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Auto-Negotiation (Speed Selection)
      2. 6.3.2  Repeater Mode
      3. 6.3.3  Media Converter
      4. 6.3.4  Clock Output
      5. 6.3.5  Media Independent Interface (MII)
      6. 6.3.6  Reduced Media Independent Interface (RMII)
      7. 6.3.7  RMII Low Power 5-MHz Mode
      8. 6.3.8  RGMII Interface
      9. 6.3.9  Serial Management Interface
      10. 6.3.10 Extended Register Space Access
        1. 6.3.10.1 Read (No Post Increment) Operation
        2. 6.3.10.2 Read (Post Increment) Operation
        3. 6.3.10.3 Write (No Post Increment) Operation
        4. 6.3.10.4 Write (Post Increment) Operation
      11. 6.3.11 Loopback Modes
        1. 6.3.11.1 MII Loopback
        2. 6.3.11.2 PCS Loopback
        3. 6.3.11.3 Digital Loopback
        4. 6.3.11.4 Analog Loopback
        5. 6.3.11.5 Far-End (Reverse) Loopback
      12. 6.3.12 BIST Configurations
      13. 6.3.13 Cable Diagnostics
        1. 6.3.13.1 TDR
        2. 6.3.13.2 Fast Link Down Functionality
    4. 6.4 Device Functional Modes
      1. 6.4.1 Straps Configuration
        1. 6.4.1.1 Straps for PHY Address
    5. 6.5 Programming
    6. 6.6 MMD Register Address Map
    7. 6.7 DP83TD510E Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Termination Circuit
        1. 7.2.1.1 Termination Circuit for Intrinsic Safe Applications
        2. 7.2.1.2 Components Range for Power Coupling/Decoupling
        3. 7.2.1.3 Termination Circuit for Non-Intrinsic Safe Applications
        4. 7.2.1.4 CMC Specifications
      2. 7.2.2 Design Requirements
        1. 7.2.2.1 Clock Requirements
          1. 7.2.2.1.1 Oscillator
          2. 7.2.2.1.2 Crystal
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Signal Traces
        2. 7.4.1.2 Return Path
        3. 7.4.1.3 Metal Pour
        4. 7.4.1.4 PCB Layer Stacking
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.