SBVS206A November   2012  – March 2015 DRV10866

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Speed Control
      2. 7.3.2 Frequency Generator
      3. 7.3.3 Lock Protection
      4. 7.3.4 Voltage Surge Protection
      5. 7.3.5 Overcurrent Protection
      6. 7.3.6 Undervoltage Lockout (UVLO)
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Start-up
      2. 7.4.2 Motor Running at Steady-State Speed
      3. 7.4.3 Motor Stopping
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

The DRV10866 is simple to design with a single-layer or two layer printed-circuit-board (PCB) layout. During layout, the strategy of ground copper pour is very important to enhance the thermal performance. Use vias on the thermal pad to dissipate heat away from the IC. Refer to Figure 18 for an example of PCB layout.

  • Place VCC, GND, U, V, and W pins with thick traces because high current passes through these traces.
  • Place the 2.2-μF capacitor between VCC and GND, and as close to the VCC and GND pins as possible.
  • Connect the GND under the thermal pad.
  • Keep the thermal pad connection as large as possible, both on the bottom side and top side. It should be one piece of copper without any gaps.

10.2 Layout Example

DRV10866 layoutexample1.pngFigure 18. PCB Layout Example