SLVSGS6 October   2023  – July 2026 DRV3901-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 ESD Ratings
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 SPI Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 External Components
      2. 6.3.2 Power Supplies and Monitors
        1. 6.3.2.1 VDRV and VDD Power Supplies
        2. 6.3.2.2 VREG Switch
        3. 6.3.2.3 VDRV Monitor
        4. 6.3.2.4 VDD Monitor
        5. 6.3.2.5 Reset (nPOR)
        6. 6.3.2.6 Device Safety Layer
      3. 6.3.3 Output Driver
        1. 6.3.3.1 STANDBY State
        2. 6.3.3.2 ACTIVE State
        3. 6.3.3.3 Overcurrent Protection
        4. 6.3.3.4 Thermal Protection
      4. 6.3.4 Trigger (TRGx) Pins
        1. 6.3.4.1 PWM Based Trigger
        2. 6.3.4.2 Trigger Monitors
      5. 6.3.5 Deploy Parameters
        1. 6.3.5.1 Deploy Delay
      6. 6.3.6 Off-State Diagnostics
        1. 6.3.6.1 Device BIST
        2. 6.3.6.2 Weak Pull-Up Test
        3. 6.3.6.3 Weak Pull-Down Test
        4. 6.3.6.4 High-Side MOSFET RDSON Test
        5. 6.3.6.5 Low-Side MOSFET RDSON Test
        6. 6.3.6.6 IREF Resistance Monitor
        7. 6.3.6.7 VREG Voltage and Capacitance Measurement
        8. 6.3.6.8 Output Load Resistance Monitor
      7. 6.3.7 SPI Watchdog Monitor
      8. 6.3.8 nFAULT/NAD Pin
      9. 6.3.9 Fault Tables
        1. 6.3.9.1 General Device Faults
        2. 6.3.9.2 Off-State Diagnostic Faults
        3. 6.3.9.3 Deployment Faults
    4. 6.4 Device Functional Modes
    5. 6.5 Programming
      1. 6.5.1 SPI Interface
      2. 6.5.2 Addressable SPI
      3. 6.5.3 SPI Error Indicators
      4. 6.5.4 SPI Format
  8. 7 Register Maps
    1. 7.1 STATUS Registers
    2. 7.2 MEAS Registers
    3. 7.3 CONFIG Registers
    4. 7.4 CMD Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Plots
      4. 8.2.4 Initialization Setup
        1. 8.2.4.1 Device Initialization - NAD
        2. 8.2.4.2 Device Initialization - Configuration
        3. 8.2.4.3 System Initialization
          1. 8.2.4.3.1 Trigger PWM Pattern Check
          2. 8.2.4.3.2 nFAULT Signalling Check
          3. 8.2.4.3.3 Device Timing Check
          4. 8.2.4.3.4 Secondary Logic Check
          5. 8.2.4.3.5 Off-State Diagnostics - Initial Check
        4. 8.2.4.4 Off-State Diagnostics - Periodic Check
        5. 8.2.4.5 Deployment
          1. 8.2.4.5.1 Targeted Device Deployment
          2. 8.2.4.5.2 Broadcast Deployment
          3. 8.2.4.5.3 Off-State Diagnostics - Post Deployment
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Electrostatic Discharge Caution
    4. 9.4 Glossary
  11. 10Revision History
  12. 11Mechanical Packaging and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Package Option Addendum

Packaging Information

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball Finish(6) MSL Peak Temp(3) Op Temp (°C) Device Marking(4)(5)
DRV3901QDGQRQ1 ACTIVE HVSSOP DGQ 28 2500 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 3901
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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