SLVSDC7F April   2017  – February 2022 DRV5032

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Magnetic Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Magnetic Flux Direction
      2. 8.3.2 Device Version Comparison
        1. 8.3.2.1 Magnetic Threshold
        2. 8.3.2.2 Magnetic Response
        3. 8.3.2.3 Output Type
        4. 8.3.2.4 Sampling Rate
      3. 8.3.3 Hall Element Location
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Output Type Tradeoffs
    2. 9.2 Typical Applications
      1. 9.2.1 General-Purpose Magnet Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Three-Position Switch
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
    3. 9.3 Do's and Don'ts
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBZ|3
  • DMR|4
  • LPG|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Output Type Tradeoffs

The push-pull output allows for the lowest system power consumption because there is no current leakage path when the output drives high or low. The open-drain output involves a leakage path through the external pullup resistor when the output drives low.

The open-drain outputs of multiple devices can be tied together to form a logical AND. In this setup, if any sensor drives low, the voltage on the shared node becomes low. This can allow a single GPIO to measure an array of sensors.